Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Thu Jan 05 10:56:49 EST 2012 | davef
The high thermal mass of metal core boards makes them difficult to heat with hot air convection heating or IR. So, edge heaters are used for effective heating of heavy core circuit boards. Hakko and VJ Electronix offer edge heaters. We imagine othe
Electronics Forum | Mon Nov 11 10:51:40 EST 2013 | dyoungquist
Are you using lead or lead-free solder? 260C would be good for lead solder but may be a bit low for lead-free. We run our lead-free selective solder pot at 300C although we do not have any pre-heat or top heat, just hot nitrogen blowing around the
Electronics Forum | Wed Feb 13 20:27:02 EST 2019 | SMTA-Chris
We’ve done similar projects. FR-811 with camera system for alignment. More cost effective than split vision. Bottom heat uses solid surface for contact heating similar to heating microwave module chassis. Our rep can arrange a demo if you haven’t
Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner
I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei
Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner
I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei
Electronics Forum | Tue Sep 19 14:40:13 EDT 2000 | Erick Russell
It is always a good idea to heat the entire board to 100C to 140C prior to reflowing the site to be reworked to reduce warp and localized stress. (Thermal uniformity of the preheater is key here). For a BGA, the laser is programmed to heat only the
Electronics Forum | Wed Sep 01 14:31:22 EDT 1999 | Dave F
| To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has any
Electronics Forum | Thu Jun 24 14:14:25 EDT 1999 | Chris
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Wed Sep 30 12:32:15 EDT 1998 | CHAD HAIMA
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. | | I would need the material to be of such a nature that I could form a cov
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