Electronics Forum: heller problem (Page 10 of 11)

Fine Pitch QFP100 Solder Joint - Need Help!

Electronics Forum | Wed Oct 30 02:37:58 EST 2002 | Dreamsniper

Hi Guys, I have a fine pitch QFP that I suspect of having a solderability (wetability) problem. The heel joint is 50%-75% of the lead thickness so it means that I passed the IPC Class 2 recommended criteria on the Heel. The toe has at least 25%-50% s

Reflow Ovens

Electronics Forum | Tue Oct 18 17:06:04 EDT 2005 | stepheniii

At one time I could show you the spacing of the chain of an electrovert but the burn marks have dissapeared. The center support chain would wrap around and jam up and with boards in the oven.............. On that one for some reason we bought it wit

Heller 1809EXL TDM repair

Electronics Forum | Tue Jun 23 22:19:33 EDT 2020 | kumarb

Hi. Have an older 1809EXL that was purchased new and has sat idle for years with 270 on hours as of today. After days of testing, unable to melt fresh paste from Loctite (SAC305). The root cause after the investigation is due to one of the 2 TDM modu

25 mil QFP soldering issue

Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek

This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet

Re: Reflow Oven Capability Study

Electronics Forum | Sat Jul 10 02:47:27 EDT 1999 | Scott

Hi! I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board

Re: Reflow parts moving

Electronics Forum | Sun Sep 12 10:51:04 EDT 1999 | K.T

Hello: We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before put

Re: Andon BGA Socket Soldering Problem - Ball Collapse

Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy

I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run

Re: Reflow parts moving

Electronics Forum | Wed Sep 08 21:32:46 EDT 1999 | Jason Nipper

Hello: We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting

Lead Free Process

Electronics Forum | Fri Jul 06 12:07:07 EDT 2001 | nwyatt

I have been researching lead-free paste for a while now and I will share with you what I can. Firstly, SnAgCu seems to be the common industry choice. It really depends on your application - the cell phone/pda sector is primarly using different comb

Researching placement machines - where do I start?!

Electronics Forum | Fri Nov 20 08:23:13 EST 2009 | jeffreyj

MikeS - Thanks for the tips. Coombs book has been on my "to buy" list for awhile now... Guess I better buck-up and get it. EMPF is an old gem, for sure, but one I had forgotten about, so thanks for that reminder. I couldn't find the SMT 101 guide at

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