Electronics Forum | Mon Jan 26 11:58:06 EST 2009 | ghcarnu
Hi there, where can I find some hints about placing the temperature sensors on the pcb when determining the reflow profile? I'm interested especially in the case of a pcb having BGA's. Thanks for your answers ! gheorghe
Electronics Forum | Wed Aug 23 16:40:30 EDT 2000 | Dr. Ning-Cheng Lee
During the second reflow, the solder remelts and resolidifies. In general, the reflow temperature is not high enough to erase the microstructure developed during the first reflow. As a result, the net effect of a second reflow typically is grain coar
Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory
| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as
Electronics Forum | Fri Sep 21 11:02:37 EDT 2001 | davef
You can measure temperatures any place that you would like, but the issue is the temperature of the solder. We've seen solder temperatures that vary from lead to lead on the same component. Why don't you want to measure the temperature of your so
Electronics Forum | Mon Jul 12 07:47:41 EDT 2010 | rgduval
Talk to your paste manufacturer, they can recommend a reflow profile (as well as advise the paste activation temperature, and liquidous reflow points. The ENIG finish should not affect your reflow parameters any more than the solder paste. Typicall
Electronics Forum | Mon Jul 12 05:54:34 EDT 2010 | xps
Hi everyone, someone knows the correct parameters for reflow the smt devices using SnPb on ENIG finishing ? Someone suggest to use more temperature than others finishing, cause nickel barrier. Someone can confirm this ? There are handbooks or articl
Electronics Forum | Mon Apr 07 11:53:44 EDT 2014 | hegemon
It's right there in front of you. Not enough overall temperature across the board. No wetting issue is evident, just looks like you need to turn up the heat, as Dave has mentioned. SOB has mentioned the issues surrounding the Electrolytic caps, ch
Electronics Forum | Fri Sep 21 21:43:16 EDT 2001 | dougk
We're used to placing the theromcouple on the solder joint and securing it with thermally-conductive UV adhesive. It's quick & easy to apply, and I've only seen a couple degrees difference from high-temp solder technique. Thoughts?
Electronics Forum | Thu Sep 18 07:38:50 EDT 2003 | cmiller
That was the method we were going to try. We have the circuitry from a sifter we make. The sifter works with a regular speaker but I could not find one working at a high enough temp for an oven. Then I lost interest or got busy.
Electronics Forum | Mon May 24 16:45:44 EDT 2004 | Bob
BTU as well as most oven manufactuers have great products. If they fit what your looking for and can give you good support(preferably local) then you should not really see any quality problems with their products. With the oven max temperature of 300
