Electronics Forum | Tue May 21 17:25:28 EDT 2002 | Carol Stirling
Hi Dave F, Thanks for the reply, the question was Customer driven. Could you clarify your recommendations for heat sealed moisture barrier bags please - does this include Nitrogen vac pack? Our production runs are small, so there is an investigat
Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma
Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Thu Mar 08 01:19:16 EST 2001 | Mike Moninger
The environment essentially defines the need for coating. "Inside" may mean inside a men's locker room with attendant high humidity or inside a climate-controlled clean environment. Conformal coatings offer protection against moisture, fungus, chemi
Electronics Forum | Wed Jul 28 20:39:25 EDT 2004 | KEN
If it works for you, great. I would be concerned with "usually very obvious". Not all solders respond like you might think (rma's, OA's, NC's). Yours works. Mine may not. Do you control your facility humidity? I find that common sense is not
Electronics Forum | Mon Mar 05 17:19:38 EST 2007 | bman
I've wondered about the 5% spec myself. Section 4.2 points out that "The oven used for baking shall be vented and capable of maintaining the required temperature at less then 5% RH.", leading me to believe this spec even applies to ovens used to bak
Electronics Forum | Mon May 30 09:11:15 EDT 2011 | davef
3a ANSI/J-STD-001: * Temperature and Humidity: 18-30°C, 30-70%RH ** If out of range, shall verify electrostatic discharge control program according to ANSI/ESD S20-20 is adequate. ** For process control, more restrictive temperature and humidity lim
Electronics Forum | Mon May 06 21:40:40 EDT 2013 | davef
ANSI/J-STD-001: * Temperature and Humidity: 18-30°C, 30-70%RH ** If out of range, shall verify electrostatic discharge control program according to ANSI/ESD S20-20 is adequate. ** For process control, more restrictive temperature and humidity limits
Electronics Forum | Mon Aug 07 14:02:54 EDT 2000 | Brian W.
If you are satisfied with the apertures, then you need to check placement pressure, plant humidity, and the reflow profile. If the placement pressure is too great, it will separate minute portions of the solder from the pad. When the solder reflo
Electronics Forum | Fri Jul 17 12:49:33 EDT 1998 | Aaron Delfausse
We currently use an ESP RMA paste. The reason that I initially posted the question was because we are conducting tests to see if this is infact the best paste for our processes. In running tests, however, certain variables, such as humidity, are ou
.gif)
