Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
Electronics Forum | Thu Feb 16 12:16:57 EST 2012 | swarnergictg
No-one should be accepting parts based solely on the presence of a C of C - from an independent or even an authorized distributor. You should have a QC plan in place that includes comprehensive visual inspection, microscope, x-ray, XRF, decapsulation
Electronics Forum | Fri Mar 09 01:48:26 EST 2018 | aemery
Unfortunately Gerber EZ is probably the one thing I know very little about. As an FSE with Speedline I only had one client at that time that was using it and an application engineer came in and helped them with it. Sorry I can't give a direct answer
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Thu Nov 01 16:26:49 EDT 2007 | kpm135
We have the BGA100 tool. It has its uses. Its nice to see if the balls on a BGA have collapsed and reflowed properly. At the same time though you can only see the balls around the edge of the BGA. It can also be dificult to position the device to see
Electronics Forum | Mon Jun 19 02:46:34 EDT 2000 | Manohar Singh
We have Fuji IP3 Machine with SMD3 Vision system. We are in an attempt to place BGA on the PCB with IP-III. The BGA is a 256 Pin, the ball size on device is minimum-25 mils, maximum-35 mils, PCB pad size is 32 mils. We don't have any specific inspect
Electronics Forum | Wed Aug 29 16:33:45 EDT 2001 | Mike Konrad
Kerry, Why don't you purchase a decent stencil cleaning system that will not leave behind dry solder paste rather than purchasing a machine to tell you how dirty your stencils are? For less than the cost of a stencil inspection station, one can pur
Electronics Forum | Tue Jan 12 19:07:07 EST 1999 | Earl Moon
| | For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | | | It appears to me that there are two options: | | A: to have a pn chart bas
Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach
What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos
Electronics Forum | Tue Oct 03 01:33:29 EDT 2000 | keihodgson
A.O.I. machine in use by my company is made by Cyberoptics and is called a Kestra. It inspsects boards prior to the reflow oven and highligts missing parts,mis-placed parts, wrong parts( by looking at any text on the device that you define, or by ori
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