Electronics Forum | Fri Jan 20 08:55:31 EST 2006 | patrickbruneel
Steve, How do you measure the resistance is it by probing the surface? Concerning the alloy there is a straightforward linear correlation between the tin content and the electrical conductivity of the alloy. The higher the tin content in the alloy,
Electronics Forum | Wed Oct 11 12:37:56 EDT 2006 | realchunks
Rob is right. ESD flooring is "Conductive" which means it can drain ESD from the body. But if you have an insulated shoe, it does not good, the ESD remains on the body. Now if you wear a smock, then you can rub ballons in your hair and touch any
Electronics Forum | Wed Jan 03 23:00:18 EST 2007 | new guy
I'm a new guy in this field. I have a question about solder paste process. Is there any effect to the solderbility if we do a lot of contact to copper pad without using any insulation ( direct to the finger ). Where can i get information about smt pr
Electronics Forum | Wed Feb 14 15:01:59 EST 2007 | davef
Latex is not a conductor. It's an insulator. So, it will not conduct a charge to the metal wire rack. You can test this hypothesis by charging a latex tube in the shop and measuring its conductivity to ground. We believe that you should not have
Electronics Forum | Wed Jul 01 11:20:19 EDT 2009 | Geo
It would, but is it correct? This is what QA came back with. "Think of a chassis, connected to earth ground, sitting on top of a mat. In this situation, we are bypassing the meg-ohm resistor to ground." If the mat, the operator and the test equipmen
Electronics Forum | Tue Sep 22 23:43:46 EDT 2009 | rohitfast
Hi Stephen, Can you pl suggest what exactly needed for the process? There is no any standard method to ensure for the ESD damage. ESDS:2020 is talking about only for persoanl and equipement grounding mechanism, in the process no insulator should be
Electronics Forum | Fri Dec 03 04:20:18 EST 2010 | grahamcooper22
Hi In Dec 2008 the IPC J STD 004 was updated to 004B, and I am wondering what the new test conditions are for testing flux Surface Insulation Resistance and Electro Migration Potential within the new spec. I am looking for the recommended test temp
Electronics Forum | Mon Aug 29 22:48:09 EDT 2011 | davef
Rich Here's what Humiseal says: Thermal Properties The coating must be able to withstand localized thermal 'hot spots' generated by components. High temperatures can cause short-term changes in coating characteristics, such as softening and lowered e
Electronics Forum | Fri Dec 09 11:00:47 EST 2011 | davef
Using common wire size and through hole diameter, we'd expect that the wave solder process would completely fill the through hole and that you wouldn't need to get involved in providing stencil openings, pasting the through hole or reflowing the jump
Electronics Forum | Tue Sep 16 15:54:39 EDT 2014 | gascon5383
I have not tried running it 180 or 90 degrees out. The process involved to change that would be too large for my company to accept it. I see where you can adjust the board stop x and y but is there a way for the z axis? I have found that the board is
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