Electronics Forum | Wed Nov 03 13:31:28 EST 2004 | russ
Could you give a specific example (sect. paragraph etc) that is giving you trouble? Russ
Electronics Forum | Wed Dec 15 12:47:59 EST 2004 | DasonC
Recommend to check http://leadfree.ipc.org I agreed the lead free is a must for environmental and human health. Not sure how soon they can found out another harmful material
Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT
I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT
Electronics Forum | Thu May 23 18:10:54 EDT 2013 | davef
I agree with Rob. These solder connections are unacceptable. BR, davef
Electronics Forum | Thu May 23 18:40:48 EDT 2013 | rway
I also agree. Even if it did meet specs, I wouldn't let a joint like this out. Reese
Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef
Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef
Electronics Forum | Mon Sep 23 01:28:13 EDT 2019 | sssamw
Cannot understood your problem very clearly, please check IPC standard on QFN and its mfg process, also check the QFN supplier's recommendation, so can minimize the bridge.
Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef
Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
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