Electronics Forum | Wed Nov 03 14:46:29 EST 2004 | dramos1
Hi Russ, Thanks for the reply. In IPC-A-610 Rev. C on section 5.2.9 {Mounting - Connectors] page 5-21 on the manual [January 2000], the acceptable class [1,2,3]listed 3 items. In order for the connector to be accepted, are all 3 items must be met? I
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Thu Nov 04 09:00:01 EST 2004 | russ
As stated by others you are out of IPC compliance, However, There are allowable deviations to the standard as long as the purchaser and manufacturer come to agreement that the non-conformance will not affect form fit or function. I would recommend
Electronics Forum | Fri Dec 08 11:50:20 EST 2000 | Michael Parker
The only instant disqualification I know of is when you are caught wearing a Sears Poncho instead of the genuine article. If not sure of the difference, get Camarillo Brillo to through a Tarot to find out.
Electronics Forum | Fri Dec 08 11:51:31 EST 2000 | Michael Parker
The only instant disqualification I know of is when you are caught wearing a Sears Poncho instead of the genuine article. If not sure of the difference, get Camarillo Brillo to through a Tarot to find out.
Electronics Forum | Fri Dec 08 14:37:11 EST 2000 | Michael Parker
Roger- No greater confidence builder in the world than to go ahead and jump in with both feet. Just do it!!!
Electronics Forum | Fri Dec 08 14:37:57 EST 2000 | Michael Parker
Roger- No greater confidence builder in the world than to go ahead and jump in with both feet. Just do it!!!
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
Electronics Forum | Wed Nov 03 09:59:47 EST 2004 | Simon UK
Hi Dennis, I would say that you must meet one of the acceptable critera if you have others list, but it depends. Do you have a specific query in relation to a solder joint or other defect?? Simon UK
Electronics Forum | Wed Nov 03 13:31:28 EST 2004 | russ
Could you give a specific example (sect. paragraph etc) that is giving you trouble? Russ
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