Electronics Forum | Tue Apr 03 12:00:55 EDT 2001 | Steve
I am looking for standards that describe acceptance criteria for PCB's. Anyone.....anyone.....Buhler. My company is an OEM manufacturer and I want to know what to look for when we receive PCB's from our PCB fab vendor. Specifically, solderability an
Electronics Forum | Sat Apr 25 12:58:13 EDT 1998 | Earl Moon
| Is there an industry standard in calculating SMT process | PPM level for benchmarking purpose ? What are the industry | benchmark ppm number for some of the defects like solder | short for 20-mil QFP, tomstone problem for 0603 components etc....
Electronics Forum | Sun Aug 16 04:47:43 EDT 2009 | zhengjb
Any acceptance criteria for hot bar soldering finishing? e.g. IPC-A-610? or anything else?
Electronics Forum | Thu Jan 12 22:29:10 EST 2023 | rgduval
So, as I understand it, IPC6012 are performance criteria that your board shop should be using. I think you'd want to be using IPC600 for acceptance criteria at incoming inspection. At least, that's what I always did in my CM days. And, since you'r
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Mon Jun 08 15:01:02 EDT 1998 | D.Lange
| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot
Electronics Forum | Fri Oct 23 15:43:31 EDT 2009 | seankim10
According to 5.2.6.1, it states that defected if Solder balls are not entrapped in no-clean residue or conformal coating. How do you define entrapment or how do you assess if the balls won't dislodge under normal product service environment? The sold
Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan
Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha
Electronics Forum | Wed Aug 15 16:09:59 EDT 2001 | monkey
Good fillet at the heel is most critical. Check out IPC standards for acceptable solder joints.
Electronics Forum | Thu Nov 04 15:06:33 EST 2004 | dramos1
Hi Russ, Thanks for the input. We already check our subcontractor mounting of the connector on the board and it seems that the problem is related to some batch of connectors from their vendor. Anyway, i believe that your suggestions on the agreement
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