Electronics Forum: jedec and moisture (Page 10 of 15)

Fine Pitch QFP Bowing after reflow

Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette

Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p

Re: Moisture Sensitive Devices

Electronics Forum | Fri May 05 11:10:07 EDT 2000 | John Thorup

Hello Aerin...welcome Actually you have already found a very important web site for your research. Go to the SMTnet archives and do a search. You will find a wealth of practical information. After that, go to the IPC or the JEDEC website and downlo

Moisture Sensitive Devices

Electronics Forum | Thu May 06 08:15:57 EDT 2004 | Christopher Lampron

Hey GAZ, The specification that addreses MSD's can be found on the JEDEC website and is JEDEC-STD-033A. I think this will answer all of your questions. Hope this helps Good Luck Chris

PCB baking for rework

Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette

The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release

Anyone Familiar with Zip-Top Moisture Barrier Bag?

Electronics Forum | Wed Aug 26 05:58:17 EDT 2009 | grahamcooper22

Hi, I have no experience of the ZIP TOP bag you refer to but my advice is to follow the guideline of IPC JEDEC 33 for sealing bags containing MSDs....it states' the MBB should be heat sealed'. I cannot imagine that a ZIP will keep the moisture out an

Baking SMT Components

Electronics Forum | Thu Jul 17 13:57:21 EDT 2008 | dphilbrick

The recommended bake temperature for components in Tape and Reel is 40C. If you use a bake temperature higher than that, the cover tape and other elements of the packaging will degrade to the point that it becomes impossible to reliably use an automa

5% color spot in HIC

Electronics Forum | Mon Jul 16 15:47:52 EDT 2012 | davef

Here's what Desco says ... Humidity Indicator Card (HIC) A card on which a moisture-sensitive chemical is printed such that it will change color from blue to pink when the indicated relative humidity is exceeded. This is packed inside the moisture-se

smd led storage

Electronics Forum | Fri Mar 19 03:13:35 EDT 2010 | mun4o

Hi, First check what the Moisture Sensitivity > Level of the LEDS is....you may need to ask the > LED manufacturer. Once you've established it is > moisture sensitive then follow latest version of > IPC JEDEC 33 spec. for storage of them and dryi

Reflow X2 = Precautions for Moisture-sensitive components

Electronics Forum | Fri Nov 02 08:30:40 EST 2001 | fmonette

For double-side reflow boards, take note that if you have moisture-sensitive components on the first side, you will need to track their remaining floor life up to the final reflow. This is because the reflow process is too fast to effectively remove

Newb needs to bake some chips help.....

Electronics Forum | Tue Jul 22 20:47:21 EDT 2008 | davef

Q1. Can I do this myself on site? A1. Sure. Most companies demoisturate their components in-house. Q2. Can we use our Vitronics Soltec XPM820 Reflow Oven? A2. You can. Most of us would be using an oven like that in our product processing. If you look


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