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Optimizing Thermal & Mechanical Performance in PCBs
SnAgCuBi and SnAgCuBiSb solder joint properties investigations
Liquid Tin Corrosion and Lead Free Wave Soldering
Placement Optimisation in a Lean Manufacturing Environment
Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures
Fundamentals of Solder Paste Technology
Comparing techniques for temperature-dependent warpage measurement
Embedded Thermoelectric Cooling Article
High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge)
Laser Direct Imaging of tracks on PCB covered with laser photoresist
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IPC Certification Training from the comfort of your home or office. See our 2024 Training schedule now.
Benchtop Fluid Dispenser
Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
World's Best Reflow Oven Customizable for Unique Applications
TIM & Thermal Gap Filler Dispensing - Download our new guide for process considerations and popular configurations.
Solutions for plasma surface treatment, selective soldering, dispensing and conformal coating – Nordson ELECTRONICS SOLUTIONS
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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jhgj x,y, z, t aat belt for 2.4/f
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jhgj x,y, z, t aat belt for 2.4/f
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