Electronics Forum | Fri Jul 02 10:30:35 EDT 2010 | kevslatvin
We used to use an APS Gold GF-120 before we went lead-free and the HT version came out. It worked fine for low volume and proto runs though not as much control over the profile as an oven with more zones. We actually had a batch oven from Bomir befor
Electronics Forum | Thu Mar 30 21:54:36 EST 2006 | mrduckmann2000
Alex, We will be using acrylics only. We are looking for a machine that will allow us to have 20 to 30 keep out areas per PCB. How's your machine at keep out areas? Thank you for any input.
Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Fri Dec 15 01:37:21 EST 2006 | shrikant_borkar
Hi, Hemendra Recently, We have carried out lead Free Soldering On our 4+1 Panasonic Reflow machine. Results were fine , but its Not Recommended for long Run. but the machine which you have is 5 zone machine and additional 2 cooling zone too. Check
Electronics Forum | Mon Jun 10 13:15:32 EDT 2002 | stepheno
My take on it, is that you can't exactly match labour to machine requirements. So the question is, which are you going to focus on? Keeping the machine busy or keeping the people busy. One or the other will have "waiting" periods. To me because the
Electronics Forum | Fri Dec 03 03:58:12 EST 1999 | Wolfgang Busko
Hi Charly, For batch ovens there is no discussion. For inline loading interval depends on the oven you use, the amount of heat the PCB takes out of the zone and the capability of the oven to get it back in. The approximate time for the PCB to stay i
Electronics Forum | Tue Sep 09 12:05:44 EDT 2008 | tonyamenson
First and fore most is to find your paste manufacturer spec sheets. Read it over several times and let it all sink in. Then call them with questions as they want to keep your business so their engineers want to help you use their product. I assume y
Electronics Forum | Wed Oct 06 23:36:28 EDT 1999 | karlin
| | | Hi, | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | Question: | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z
Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian
| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab
Electronics Forum | Thu Apr 29 10:02:07 EDT 1999 | Chrys Shea
| Anyone using hot air nife for wave soldering process. | Does it work? | Does it really eliminate solder bridging and does it create any other problems? | | any feed back will be much appriciated. | | Thanks | | Tony A | | Tony, The hot knif
