Electronics Forum | Tue Jun 05 16:40:46 EDT 2001 | kerryn
Thanks Phil. However, my objective is to identify stencils that are not 100% clean prior to sending to inventory. I want to catch it before the solder paste has a chance to dry and harden in the apertures. Kerry
Electronics Forum | Thu Oct 24 15:02:16 EDT 2002 | seand
Hello Yannick, Have you brought this concern up with your supplier? I would recommend speaking with your flux and paste provider to gain additional insight and recommendations for resolving the concern. Good luck, Sean D.
Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie
We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.
Electronics Forum | Fri Oct 30 10:17:05 EDT 2015 | esoderberg
You don't say how many headers you have to solder. I usually spec in High temp headers and use a pin-in-paste methodology and double reflow. Can you get your headers high temperature?
Electronics Forum | Thu Nov 30 15:19:56 EST 2006 | CK the Flip
Mike, dude, I feel your pain. Hearing stories like this makes my blood boil! It's almost as ridiculous as a customer who told me to put more solder paste on a MELF component to overcome noise issues - he used more solder paste as antennas to overco
Electronics Forum | Tue Jan 31 12:13:26 EST 2006 | Calvin Kolokoy
Today's regular Sn-Pb paste chemistries are designed to run at higher peak temperatures ensuring that your lead-free alloys will coalesce with your regular Sn-Pb solder. That being said, it is do-able to solder both types in one oven. Generally, wit
Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber
Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore
Electronics Forum | Tue Jan 31 12:53:50 EST 2006 | Chunks
We just did this and are awaiting the results. Solder balling and a burnt looking flux where visual indicators that we noticed running regular paste at no-lead temps.
Electronics Forum | Wed Feb 01 07:32:05 EST 2006 | Chunks
Try an intermediate paste like Loctite/Henkle 218. It's design is to be used in a mixed lead/lead-free process.
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
