Electronics Forum | Tue Aug 28 16:41:42 EDT 2001 | davef
Very few concern themselves about the strength of solder connections, because it doesn�t require much strength to keep a solder connection attached to the board. More important are factors that arise as a result of the different materials properties
Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F
snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do
Electronics Forum | Sat Mar 25 00:02:17 EST 2006 | rpowell
Hi everyone, I'm relatively new to SMT PCB design and am running into some frustration with the land pattern design of "standard" smt components in particular passive chip components. It seems each manufacturer (Yageo, Rohm, Panasonic) has their own
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
Electronics Forum | Thu Mar 02 09:13:07 EST 2000 | jacqueline Coia
Could anyone please tell me if there is a quick simple formula for working out the ideal SMD footprint for a 52 pin QFP using the dimensions specified on the manunfacturers component drawing. I know of the IPC 'SMD land patterns' standard, which I e
Electronics Forum | Wed Mar 01 17:07:50 EST 2000 | Dave F
Brian: Several things: � Many CAD systems offer compliant pad design libraries � Look at IPC-SM-782 "Surface Mount Design And Land Pattern Standard" � Some times, component manufacturers have the best information about pad designs for their compone
Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau
RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have
Electronics Forum | Wed Jun 28 07:45:39 EDT 2000 | Wolfgang Busko
Hi Allan, I can�t help with literature on that topic but we have great success with solder thiefs to prevent bridging with 2mm pitch THT-connector. We added just blind pads of the same size at the end of each row similar to what you can do with SMD
Electronics Forum | Thu Mar 02 09:13:07 EST 2000 | jacqueline Coia
Could anyone please tell me if there is a quick simple formula for working out the ideal SMD footprint for a 52 pin QFP using the dimensions specified on the manunfacturers component drawing. I know of the IPC 'SMD land patterns' standard, which I e
Electronics Forum | Wed Mar 01 17:07:50 EST 2000 | Dave F
Brian: Several things: � Many CAD systems offer compliant pad design libraries � Look at IPC-SM-782 "Surface Mount Design And Land Pattern Standard" � Some times, component manufacturers have the best information about pad designs for their compone
