Electronics Forum | Mon Jun 27 10:45:31 EDT 2005 | franciscoioc
Thank's for the information Bob. I have another question, at the moment my peak reflow is at 218c, this means I am above the 210c a lot of companies run off. If I am building boards using SN63/37 solder paste with lead on my process, and using lead f
Electronics Forum | Tue Jul 13 06:49:53 EDT 2004 | imtiaz
In one board we are using 213 SMT components out of which 23 components are lead-free and the rest are leaded. The paste used is also leaded. Do we have to make any changes in the profile of our reflow oven ? Also will there be any negative effect on
Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds
Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr
Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101
Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo
Electronics Forum | Wed Jul 14 00:50:34 EDT 2004 | Grant Petty
Hi, What's the best process for going lead free? Ordering lead free parts and using them with current paste, and then once all the parts are lead free, moving to lead free paste as well? Then the wave will be fun to change over. What a nightmare th
Electronics Forum | Wed Apr 13 09:43:00 EDT 2011 | dyoungquist
A bit more information will help people give a more educated response. What size res/caps? Any fine pitch ICs? BGAs? Lead or lead free? What quantity of components and/or boards are you loading? Will it be high mix, low volume or lower mix, hig
Electronics Forum | Tue Jul 13 07:22:43 EDT 2004 | Kris
Hi Imtiaz, Can you give a brakup of the 23 components and their end mettalurgy ? Chip ?? QFP/TSOP ?? BGA ?? Aluminium Caps ?? this will determine whether you can do it or not
Electronics Forum | Tue Jul 13 10:12:06 EDT 2004 | davef
While you're waiting for others to reply, consider searching the fine SMTnet Archives for threads like this: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=7290&#Message29140
Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais
We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size
Electronics Forum | Fri Jun 08 18:27:03 EDT 2007 | jmelson
This is probably an inner plated layer of the component that did not bond well. It may be a component that either has the wrong surface finish for lead-free or can't handle the temperatures. Many times I have seen a similar-looking layer when the l
