Electronics Forum: longer (Page 10 of 113)

Fujicam programming

Electronics Forum | Thu Apr 01 17:15:05 EST 2004 | ricardof

What programming systems are you using now? F4G is no longer supported, so I guess that's not a relaible option to move on. FUJICAM is currently in good shape, most of the bugs are cleared

Hand tools @ work station ?

Electronics Forum | Tue May 18 09:40:46 EDT 2004 | russ

Can you have them checked in and out at the beginning and end of each shift? Any missing tools must be paid for by employee, This does make them stick around longer. Of course then you end up with "someone came by and took them" excuses. but it d

LSP profile

Electronics Forum | Mon Jun 07 17:28:07 EDT 2004 | edatasys

LSP is 'Long Soak Profile'. See http://www.aimsolder.com/tds/NC_297DX_Sn62_&_Sn63_Solder_Paste.pdf Looks like a variation of the RSS, with you guessed it a longer soak.

Conformal coat removal

Electronics Forum | Fri Jul 23 08:58:11 EDT 2004 | RDC

I know Micro Care made a unit that removed conformal coating with compressed air and a solvent. But they no longer make it. Does anyone have the 2000 version of this unit and may want to sell it or know of another compressed air solvent solution, p

Un-Reflowed Paste

Electronics Forum | Wed Jul 28 00:12:48 EDT 2004 | NTV

It would be uncontrolled reflow process. Solder paste smeared, outdate solder paste, contamination, and many else could lead to this issue. A longer time reflow window would help elimating it (make it max. of 60 seconds liquid time).

Un-Reflowed Paste

Electronics Forum | Wed Jul 28 00:12:52 EDT 2004 | NTV

It would be uncontrolled reflow process. Solder paste smeared, outdate solder paste, contamination, and many else could lead to this issue. A longer time reflow window would help elimating it (make it max. of 60 seconds liquid time).

Un-Reflowed Paste

Electronics Forum | Wed Jul 28 00:12:58 EDT 2004 | NTV

It would be uncontrolled reflow process. Solder paste smeared, outdate solder paste, contamination, and many else could lead to this issue. A longer time reflow window would help elimating it (make it max. of 60 seconds liquid time).

Un-Reflowed Paste

Electronics Forum | Wed Jul 28 00:13:21 EDT 2004 | NTV

It would be uncontrolled reflow process. Solder paste smeared, outdate solder paste, contamination, and many else could lead to this issue. A longer time reflow window would help elimating it (make it max. of 60 seconds liquid time).

Un-Reflowed Paste

Electronics Forum | Wed Jul 28 00:13:23 EDT 2004 | NTV

It would be uncontrolled reflow process. Solder paste smeared, outdate solder paste, contamination, and many else could lead to this issue. A longer time reflow window would help elimating it (make it max. of 60 seconds liquid time).

Can excessive reflow(longer dwell time) cause open joint?

Electronics Forum | Fri Jul 30 09:59:10 EDT 2004 | Steve

Excessive Time above Liquidus will cause a solder joint to become extremely brittle. Any shock or stress to the joint can lead to a failure.


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