Electronics Forum | Fri Mar 26 15:48:31 EDT 2021 | grahamcooper22
Leaded HASL on small pads can be quite difficult to print on...the HASL tends to be domed rather than flat..and that can affect print quality...you really need a perfectly flat pcb pad to print paste on when you are assembling 0.5mm QFPs. If the pcb
Electronics Forum | Mon Jun 25 09:08:22 EDT 2001 | Dave G
What type of board finish ? I've seen this same defect with QFP's on some of our HASL boards. Best I can tell either the PCB's have poor solderability or uneven pad heights due to poor solder leveling at the PCB fab. Newer PCB's seem to yield bette
Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG
We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w
Electronics Forum | Thu Nov 11 17:04:31 EST 1999 | Michael Parker
I am looking for advice on sourcing a x,y digitizer to create pick and place files, off-line, rather than programming with the machine. I could use original gerber data or create the placement coordinates with the digitizer. Also, references to equip
Electronics Forum | Mon Jan 25 18:03:34 EST 1999 | Joe
Greetings, Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. Also, is there any danger of the pcb's giving off some kind of gas or vapour which can be harmfu
Electronics Forum | Thu Nov 19 15:44:34 EST 1998 | Earl Moon
| We are investigating purchasing boards off-shore (Topsearch). Part of their process is to punch the matrix instead of router them. These boards are mixed technology. Is anyone aware of difficulity processing punched boards? | Thanks, | Mike | Big
Electronics Forum | Wed Jun 24 14:20:53 EDT 1998 | Ben Salisbury
I know this topic has probably been talked about before...But I ran into a small situation where Solder Balls were appearing in large quantities on the PCB....the Problem has been isolated and taken care of, my question is, what are some good methods
Electronics Forum | Fri Apr 17 14:37:13 EDT 1998 | Justin Medernach
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, Try
Electronics Forum | Fri Apr 03 03:17:03 EST 1998 | Jacqueline Coia
We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisation is i
Electronics Forum | Wed Apr 08 17:44:49 EDT 1998 | Wayne Bracy
| We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisation is
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