Electronics Forum: melf doide poor soldering after reflow (Page 10 of 12)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: PCMCIA QFP Process Issue

Electronics Forum | Tue May 23 20:44:13 EDT 2000 | Dave F

Sal: You and Wolfgang are spot on, but let's see if we can blow this out a bit. Before proceding to rattle on ... � PC Card. A credit card-size computer peripheral that add memory, mass storage, and I/O capabilities to computers in a rugged, compa

Re: Solder Resist Solder balls - 'N Surface Energy

Electronics Forum | Thu Dec 24 08:44:25 EST 1998 | Earl Moon

| | | | Folk's, | | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colou

Re: no-clean processes - are gloves necessary?

Electronics Forum | Thu Oct 21 09:56:11 EDT 1999 | Brian

Rich An excellent question and one which is often totally ignored. If you wish a "no-clean" flux to be as safe as it possibly can be, the PCB and the components must all be contamination free (ionic and non-ionic). Only then can you be sure that the

Re: Cracking in High Voltage Chip Caps

Electronics Forum | Tue May 26 17:29:42 EDT 1998 | Earl Moon

| I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. | We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. U

Re: Moisture sensitive device processing

Electronics Forum | Mon Apr 26 12:51:45 EDT 1999 | Bob

Steve, Moisture sensitivity needs to be taken seriously. Being in the commercial end of electronics now, I am using many plastic packages. Unfortunately, moisture sensitivity processing is not black and white and it does require procedures and dis

BGA void removal

Electronics Forum | Sat Oct 19 08:33:50 EDT 2002 | johnw

The whole thread seem's to have gone off track. Russ we've been doing a fairly big bit of work on the whole BGA voidign thing as we were so unhappy with the answer's that we were getting from around the industry, basically no one really kows all the

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell

| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir

Re: Wetting Balance Equipment

Electronics Forum | Mon Aug 17 02:57:47 EDT 1998 | Bob Willis

| | Looking for Suppliers of surface mount wetting balance equipment. | Bucky: Section 6 of the ANSI/J-STD-002 specification lists wetting balance suppliers. Dave F I like and continue to use the Multicore system. I have had many ours using the sys

Re: Problems with wave solder

Electronics Forum | Thu Nov 19 08:20:04 EST 1998 | Earl Moon

| | | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave so


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