Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
Industry News | 2011-09-28 19:37:44.0
Nihon Superior introduces the new Selector Guide for SN100C solder pastes.
Industry News | 2011-12-14 15:03:10.0
Nihon Superior will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder in booth East 30-13 at the upcoming Internepcon Japan exhibition. SN100C now has a track record of more than 12 years of successful delivery of high productivity and high reliability.
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Low Velocity Nitrogen Convection for BGA Solder Ball Attachment and Semiconductor Backend Assembly
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
New Equipment | Rework & Repair Equipment
Reworking small chip components like 01005, 0201, 0402, & 0602s are difficult and require specialized tools. Metcal has developed a technique and identified a selection of tools that enable the operator to rework these small components with repeatab
YAMAHA YV100X Chip Mounter YAMAHA YV100X Chip Mounter Patch speed 18000CPH L1,655XW1,408XH1,850mm weight:1,450kg Product description: YAMAHA YV100X Chip Mounter INQUIRY yamaha YV100X chip mounter Products Description:
http://www.flason-smt.com/product/YAMAHA-YV100X-Chip-Mounter.html YAMAHA YV100X Chip Mounter YAMAHA YV100X Chip Mounter Patch speed 18000CPH L1,655XW1,408XH1,850mm weight:1,450kg Product description: YAMAHA YV100X Chip Mounter INQUIR