Electronics Forum: mount devices (Page 10 of 24)

Re: Drying ICs any advice

Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783

| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |

Re: castellations vs. no castellations

Electronics Forum | Mon Jul 26 19:32:03 EDT 1999 | Steve Gregory

| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of

Re: SMD mounting height

Electronics Forum | Sun Apr 19 13:52:45 EDT 1998 | D.Lange

| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI

Re: SMD mounting height

Electronics Forum | Sun Apr 19 13:50:41 EDT 1998 | D.Lange

| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI

Through-hole/SM mix

Electronics Forum | Fri Oct 12 13:40:56 EDT 2001 | Steve

I need help with a process issue. I am dealing with a board design that is double-sided SM with a couple high density through-hole devices. I want to flow solder the through-hole stuff, so what is the best way to deal with them? Since one of the thro

Re: I looking for a beta site for a new drying process

Electronics Forum | Thu Aug 19 14:06:07 EDT 1999 | Stu Leech

| | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large sca

Re: I looking for a beta site for a new drying process

Electronics Forum | Thu Aug 19 14:52:13 EDT 1999 | John Thorup

| | | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large s

Re: Stupid follow-up

Electronics Forum | Fri Aug 21 07:57:20 EDT 1998 | Earl Moon

| | | Will somebody please explain HASL (here). Thanks. | | Tryin: HASL: Hot Air Solder Leveled. A board fabrication process that applies an oxidation preventing solder coating to copper pads on the board. Dave F | You do this to keep the green s

Re: Any help reflow soldering Through Hole parts

Electronics Forum | Mon Mar 09 16:36:38 EST 1998 | Jim McLenaghan

| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need

Wave solder of TQFPs

Electronics Forum | Wed Jul 19 01:20:17 EDT 2000 | Craig

Does anyone have any experience wave soldering TQFPs. Our R&D is wanting us to do this but we (production) are hesitant. I've found some recommended pad designs and solder theiving designs in a Philips app note "SMD Mounting Methods". The theory look


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