Electronics Forum | Mon Sep 09 17:01:21 EDT 2013 | proteus
I wish I knew the MSL. The factory data sheet from 1995 does not list the specification. The moisture problem makes perfect sense for what I'm seeing. When we replace these parts by hand (no reflow) the failure rate goes down to almost non-exist
Electronics Forum | Mon Nov 17 07:15:36 EST 2014 | garym4569
If you have feeders that you want to always stay on the same machine/position, enter them in the permanent data for the machine in the MSL setup. That is a simple way to reserve locations. Also, the optimization can use any common parts set in perm
Electronics Forum | Thu May 12 14:15:50 EDT 2016 | kahrpr
This is just me but I would just let it air dry. If you think about it. If you were using water soluble paste you would run it through a washer and it would survive. If this was a BGA i would be very concerned. If you are truly worried look an the ma
Electronics Forum | Wed Jul 13 17:50:26 EDT 2016 | davef
From "Assembly" magazine, "Moisture-Sensitive Devices" [ http://www.assemblymag.com/articles/85082-moisture-sensitive-devices ] ... a description of the moisture sensitive device problem. I agree with Evtimov * During board assembly solder process,
Electronics Forum | Fri Jul 15 12:02:45 EDT 2016 | davef
This conversation is making my head hurt. Before your engineers respin the design, some basic questions need answers. * How do you know that the field failures were caused by MSD damage? * What is going on in the field that is causing these failure
Electronics Forum | Wed Apr 26 06:09:12 EDT 2017 | ajaytyagi
Hi, Pl let me know about opinion/experience whether thick film chip SMD resistor which is MSL-1 Required to bake before being usedon SMT line. I want to use SMD resistance spool which is around 2 yeasr old kept at 25 deg room temperature at around 4
Electronics Forum | Wed Apr 26 08:13:47 EDT 2017 | spoiltforchoice
MSL 1 is unlimited factory floor time before reflow. I have spools that are 10+ years old and haven't encountered any issues using those parts. It goes without saying those parts are not exactly used in volume so its not a massive sample but that is
Electronics Forum | Fri Apr 21 08:07:10 EDT 2006 | amol_kane
I struggled with the std too, when trying to justify the need for a desiccant cabinet. according to my interpretation: 1. the components are baked at 125 or 150 dec C within 24 hrs of manufacture (this is MET) and sealed in the MBBs at the component
Electronics Forum | Fri Dec 01 12:40:04 EST 2000 | Dason C
I agreed with PeteC to use the selective wave pallet, please aware TSSOP is classify as MSL 3. The advantage of the surface mounting allow both package body size and thickness to decrease but also increase the density of the package. Direct heating
Electronics Forum | Fri Jan 04 15:34:49 EST 2002 | fmonette
As Dave mentioned we have put together a MSD audit checklist to insure that your internal procedure is complete and in line with J-STD-033. It's a free download at http://www.cogiscan.com, click on Moisture Sensitive Devices to access the MSD Knowle
