Electronics Forum | Tue Apr 17 10:16:42 EDT 2001 | davef
Welcome to SMTnet. Awww, those assemblers are always whining about something. Just tell him to shut-up and build the blankin� boards. Jeesh!!! We used to have copious archives on the topic on SMTnet and our friend Brian is working his fingers t
Electronics Forum | Mon Jun 25 20:39:08 EDT 2001 | ianchan
Hi mate, no complete info given from what i see, so just some humble comments, mayhaps you review : 1) PCB pad finishing - Copper+nickle plated? coz if so, nickle is a KILLER to good solder wetting. what we did back here, was to HAL coat the nickle
Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup
Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the
Electronics Forum | Fri Sep 10 14:32:49 EDT 1999 | John Thorup
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Mon Jul 19 11:11:18 EDT 1999 | Wolfgang Busko
| Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still t
Electronics Forum | Mon Jul 19 11:50:47 EDT 1999 | Mario
| | Hi, SMTASSY | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | First, we do not do real series produktion, only prototyping up to sometimes 20 uni
Electronics Forum | Fri Apr 16 11:07:53 EDT 1999 | Vic Lau
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Mon Apr 19 02:45:31 EDT 1999 | Brian Sloth Bentzen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Fri Aug 21 14:29:37 EDT 1998 | Earl Moon
| HASL: (hot air solder leveling) is a process used to cover the Cu. Either Sn/Pb is used or Ni/Au or some other combo. In one case you create a land pad and in the other (with resin)you cover the Cu so that you only have a "trace." Is that correct s
Electronics Forum | Fri May 15 21:59:42 EDT 1998 | Earl Moon
| Hi, | There has been a lot of disputes in our company | about changing present HASL to another Finishing | which can provide more flatter pad surface in fine | pitch applications. ( perhaps Ni/Au, OSP ) | The target is to reduce solder defects, t
