Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris
Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o
Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris
Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o
Electronics Forum | Mon Nov 04 07:31:54 EST 2019 | amitthepcbguy
As a manufacturer, I prefer plated nickel gold, electroless nickel immersion gold, immersion silver and palladium. These surface finishes are the best options to replace leaded surface finishes. These surface finishes can withstand higher temperature
Electronics Forum | Thu Sep 15 02:51:45 EDT 2005 | Joris Groot Koerkamp
In our current process we don't need to dry our pcb's. We use FR4 HASL boards. For the leadfree process we want to use NickelGold plated boards. Do we have to dry these boards for the leadfree process or can we just seal them with silica gel?
Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup
| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I
Electronics Forum | Tue Jul 08 20:43:03 EDT 2003 | davef
AlCapone: We have an understanding similar to yours, but slightly different. * At 230*C gold dissolves in to solder at the following rate: 63/37: 197 uinch/sec [5 um/sec]. So for a typical ENIG solderability protection, the gold is gone in about a s
Electronics Forum | Tue Jul 05 11:00:37 EDT 2005 | patrickbruneel
Inds, This will happen with all lead-free alloys having a tin content above 70%. It takes about 30 sec. for a molten lead-free alloy to totally dissolve a copper pad. The higher the temperature the shorter the time and visa versa. The scary part of
Electronics Forum | Wed Mar 26 12:15:11 EDT 2008 | patrickbruneel
Hi all, I wanted to share this with y�all, because it�s informative on what is to come but at the same time hilarious. ******************************************************** From Dr. Craig Hillman (DfR Solutions) RoHS 2 Moves Forward (Run For Yo
Electronics Forum | Tue Jun 29 16:09:44 EDT 1999 | Dave F
| Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating into liquid solder. Nickel barrier unde
Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
