Electronics Forum | Mon Oct 14 19:59:17 EDT 2013 | hegemon
We do in fact see a reduction in soldering defects, most especially wetting issues for both parts and PWBs, tombstones, billboards, etc... As a CM we see all kinds of customer furnished material, some of it not in the greatest condition. Our best p
Electronics Forum | Wed Jun 27 11:13:44 EDT 2012 | mosborne1
We are seeing PLCC socket leads not soldered in our SMT process. We are using a KIC thermal profiling device and we are on 50% greem light process window. All other solder joints on the board looks great. The solder flowed what looks like perfect on
Electronics Forum | Tue Oct 11 22:58:19 EDT 2005 | KEN
Isn't it funny how solder manufacturers are adopting a spec. limit of "not to exceed 1000ppm of lead content". Doesn't leave much room for the rest of the "process".
Electronics Forum | Sat Nov 12 07:25:26 EST 2005 | GS
In other words it should mean that Lead Free Soldering Process (this SACs era, and not for istance classic Lead Free Sn/In used since many years ago) is still a "Baby Technology" and so we need experience and feedback from the field before to issue
Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon
Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your
Electronics Forum | Thu Jul 02 17:46:46 EDT 2020 | emeto
There articles about mixed metallurgy and possible quality issues with this kinds of joints. As it is just repair, I would assume it is a local fix, so you should probably go Pb-free paste. If you want to reflow the board I would re-ball the BGA to m
Electronics Forum | Fri Jul 22 03:07:45 EDT 2005 | Joseph
Dear all, As we know there is a high risk of reliability issue due to lead contamination during mixture of NLF component at LF wave soldering process. But we have the following feed back from one of our customer as follow: Concerning the risk of m
Electronics Forum | Tue Mar 07 20:48:59 EST 2006 | rbodmer
Craig. i spoke with a process engineer today and he told me that if you mix pb and non pb it may work but may cause premature failures if in a thermal cycleing environment. failure cause may be micro fractures.
Electronics Forum | Tue Mar 15 10:18:15 EDT 2011 | grahamcooper22
Hi, Does anyone have any experience of cleaning lead free solder paste residues off pcbs in a vapour degreasing process using Ensolv Ionic ? Any guide as to the best cleaning cycle would be appreciated. thanks
Electronics Forum | Mon May 15 15:13:22 EDT 2000 | aflewelling
Michael: Thanks for the recommendations. The �New Technology� and �Future Technology� forums sound a lot like what we have in mind for the OnBoard Forum (OBF). In fact, we are in the process of lining up, for an upcoming OBF, an author of a �Lead
