Electronics Forum | Fri Nov 23 07:51:25 EST 2007 | shy
Hi there, kindly help to advice me either epoxy/glue at bottom SMT component such as chip package 2012 will cause the component to be non-wetting after run reflow process?
Electronics Forum | Fri Oct 17 22:36:35 EDT 2008 | arosario
Hi All, We just started build a new product and I am encountering many non-wet rejects in our new product. I need help on what should I look into to improve our Yield. Please see below back ground 1. We are using DEK Infinity as printer. 2. We are mo
Electronics Forum | Sun Oct 19 08:11:12 EDT 2008 | davef
While you're waiting for others to reply to your question on component analysis laboratories, search the fine SMTnet Archives to find posts like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=35636
Electronics Forum | Tue Oct 21 10:57:15 EDT 2008 | arosario
Hi Dave, thanks for the info. I'll check the detail and try to send sample SMD's for test. - Bong
Electronics Forum | Tue Oct 21 11:19:30 EDT 2008 | ljohnson
Sounds to me like your printer not releasing paste now and again. How can you be sure that you are not getting print skips. Are you using any kind on AOI?
Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Mon Jun 18 10:20:14 EDT 2007 | ck_the_flip
Grant, i have heard of a few cases where the PCB is "reworked" by the PCB house, where the immersion silver that did not wet to the base copper was reworked by just putting immersion silver on top of the non-wetted immersion silver. I know your PCB
Electronics Forum | Wed May 09 13:11:22 EDT 2001 | zam_bri
Hi.. Recently, I have received a few reels of 0402 with an old date code ( but still less than 2 years old).I don't have a capability in-house to carry out the solderability test except for the dipping test ( dip the components in the molten solder
Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe
Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
