Electronics Forum | Thu Apr 03 09:48:31 EST 2003 | davef
R1: Contacting Altera to find out if the BGA pads are gold. D1: Bet money the pads were ENIG. R2: Contacting Altera to find out if they use abrasives. D2: If abrasives were the problem, you�d see it in many pads, especially those close to the probl
Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor
Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve
Electronics Forum | Thu Mar 08 08:03:16 EST 2007 | ck_the_flip
ENig can vary in quality, but I've never seen an ENiG board that's been downright unsolderable. At a CM where I worked, I had to prove a QE wrong. He was flippin' out (*no offense*) about black pad, something commonly seen on ENig boards, so what I
Electronics Forum | Wed Oct 28 17:30:55 EST 1998 | Chrys
| | Can anyone supply me with info on determining the volume of paste left on a pad once reflowed compared to the intial amount put down? Is there a formula or something? | | | That information should be contained in the technical data sheets suppli
Electronics Forum | Mon Dec 10 13:56:51 EST 2001 | slthomas
1) The additional activity of the OA flux probably took care of the oxydation. How do you plan on taking care of the presence of conductive and corrosive residues from it now, though? You're not supposed to wash those parts with water. 2) The tomb
Electronics Forum | Fri May 17 15:51:32 EDT 2002 | davef
First thing that comes to mind is that your �dip & look� testing at 240�C clearly doesn�t represent the in-use application of 215�C. So, what are the test results at 215�C? Other questions are: * Can we assume that the solderability of other compon
Electronics Forum | Wed Mar 15 00:44:39 EST 2006 | vicknesh28
Would i be able to judge how good is a reflow profile from the appearance of the flux residue? Often times i come across flux (not sure if residual) between a non-wet QFP lead and the reflowed solder paste on the pad (it's sandwiched between the bott
Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy
Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your
Electronics Forum | Fri Jul 23 02:54:47 EDT 2010 | wizzkid
I think that it can be solved by placing ths into a baking oven with the set point above the PCB Tg. For this process to be succesful, weights need to loaded onto the PCB stack during the heating cycles. Once the cycle is complete, the PCB stack will
Electronics Forum | Mon Jul 29 19:39:57 EDT 2013 | hegemon
No problem running lead free without nitrogen. Careful profiling will take care of the soldering. Cosmetically, the Nitrogen reflow is superior for lead free, and we see much better wetting, better coverage of the PWB pads, and of course the smooth
.gif)
