Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe
OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by
Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7
My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a
Electronics Forum | Tue Nov 29 14:55:17 EST 2011 | jlawson
N2 is a reflow process widener so to speak, for leaded reflow less of a impact, for LF more impact, and if using finer LF solder pastes T4,T5 and smaller paste deposits generally, it helps widen window for flux in paste in oxide protection during soa
Electronics Forum | Fri Feb 20 15:07:31 EST 2004 | agp
I agree with Jay. The paste will reflow first before the balls. The main reason is the flux content and the dimension of the spheres.
Electronics Forum | Fri Dec 11 08:56:08 EST 2020 | SMTA-64304223
One of the common causes of solder ballin is also outgassing from the boards have your tested the board for outgassing? Bob Willis
Electronics Forum | Fri Dec 11 13:06:54 EST 2020 | johndep7
I haven't, that is a good idea, I was reading about the chance of that earlier but I was not sure. The best way to eliminate is to bake the board?
Electronics Forum | Fri Jan 15 07:23:14 EST 2021 | denism
Also, solder splashes can be due to contamination, for example, on the terminals of components. In the past, had a problem with solder splashes on a seemingly standard SMD component. The reason was the incorrect nickel plating process of the componen
Electronics Forum | Tue Jan 19 10:18:58 EST 2021 | grahamcooper22
Hi, try a low spitting cored wire...something like ALMIT SR-LA cored wire...or SR-LA SUPER...it eliminates flux/solder spitting during soldering.
