Electronics Forum | Thu Oct 23 18:39:41 EDT 2008 | kiter
Was wondering if anyone has a general chart matching SMT package size with tape feeder size. E.g 0602: 8mm Tape 2mm pitch. Cheers.
Electronics Forum | Fri Nov 07 12:28:22 EST 2008 | evtimov
Hi, most common parts were mentioned already. For all the rest you will have the simple counting we all do. Distanse between two holes in the tape is 4mm. You dont need special software for that. packages for passive parts you will learn fast.
Electronics Forum | Fri May 26 16:24:45 EDT 2006 | Jak
Due to spacing issue, we are considering using power bricks with tin/lead solder ball instead of PTH package. The solder ball is 40 mil diameter. Our CM suggested they do hand place since the pick and place nozzle cannot pick up and hold the part due
Electronics Forum | Fri Nov 30 19:39:51 EST 2007 | mika
Hi chs, What type of QFN or MLF package are we talking about? Assuming there is a middle thermal pad? Body Size & no. of terminals & pitch? What about your statement: "This package is so sensitive to any external force". Can you please explain what y
Electronics Forum | Thu Feb 11 07:24:40 EST 2016 | truewanderer
I'm planning to design the pcb of my project. The controller used is having 136 pins and the package is P-LFBGA. So i think i need to design a 6 layer board for better performance. I haven't designed a multi layer board before. So what are things tak
Electronics Forum | Thu Aug 10 21:25:57 EDT 2000 | Dave F
Charles: Thank you for closure. It's nice to learn the answer.
Electronics Forum | Fri Feb 19 05:08:40 EST 2016 | truewanderer
Thank you Tsvetan Usunov
Electronics Forum | Fri May 06 08:39:59 EDT 2016 | kahrpr
The first issue I see is that you have a high potential of the 402 tombstoning.
Electronics Forum | Sun Dec 02 20:02:23 EST 2007 | chs
Hi, There are QFN 32,40,48 pins with middle pad. Body size are 7x7 and pitch 0.5mm. I means as compared to 2 sided package, QFN are easily damaged by external mechanical / thermal force. Phenomenon observed are mold cap open which further caused wire
Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
