Electronics Forum | Wed Jun 17 10:43:39 EDT 1998 | M.Wilmsen
Is there any industry standards regarding shelf life for components? Also do they very between component type packaging? Thanks
Electronics Forum | Tue Jan 13 10:53:05 EST 1998 | Tonya Warner
It is also my job to ID and cross components. I have found that the same number can be used by different manufacturers for different parts, same package style. There is not a standard marking system for SMT devices so watch out for this.
Electronics Forum | Fri Jan 04 15:27:04 EST 2002 | davef
There is no standard. Component loss is a function of many factors, including: * Component type. * Component packaging. * Machine capabilities. * Feeder maintenance. Search the fine SMTnet Archives on attrit* for some guidelines.
Electronics Forum | Thu Mar 21 15:06:43 EST 2002 | caldon
Spare parts...Does the machine come with a Standard package of spares....... Have the feeders also been refurbished as well as the machine? Has the machine been updated for the most current upgrades(Eproms, Software...) ? What is the cost to purca
Electronics Forum | Wed Oct 09 11:15:40 EDT 2002 | Randy V
Boothroyd and Dewhurst has DFA packages that are pretty good but are more for analyzing one design to an alternate design vs giving good times for your particular site, etc. You can find their site on the WEB.
Electronics Forum | Tue Sep 07 16:58:16 EDT 2004 | davef
Au contraire, mon ami. Although there is not "BGA" solderability test specified in J-STD-002A, the Test S can be used to assess solderability on BGA packages. [Joint Soldering Technology Committee ]
Electronics Forum | Wed Sep 13 11:23:37 EDT 2006 | teamcanada
Is there any published info on acceptable losses in SMT assembly. Especially for small to medium sized production runs with switch overs several times weekly Different losses for component sizes and packaging? Thx Vaughn
Electronics Forum | Tue Oct 17 15:31:29 EDT 2006 | TM
I've got some MELF packages that reflow and connect but later fall out of the solder pretty easily. We are not using epoxy but, the parts have fillets per IPC standards. We have not looked at cross-sectioning for IMC and don't plan to at the moment
Electronics Forum | Tue Jan 23 06:16:13 EST 2007 | Ayelet
Hi, I am lookinh for standards that define the cleanliness level of the assembly room and also for the test and packaging room. I understand that tehre are some defintions of tempertaure and humidity that shoudl be met. Are there any specs for part
Electronics Forum | Thu Jan 25 04:47:19 EST 2007 | GS
see also the complete specific series of IEC-60286,IEC-60286-3, IEC-60286-4, IEC-60286-5,IEC-60286-6. All of those specs are realated to packaging specifications. Tape, reel,stick magazine,tray, bulk case,etc. Regards.....GS
