Electronics Forum | Fri May 06 06:51:55 EDT 2016 | abhilash4788
Hi All, One of my customer has provided a pcb design having common pad for 0402 and 1206 package(i.e 3 pads in the gerber, pad1,pad2 belongs to 1206 package and pad2,pad3 belongs to 0402 package) Will this create any solderability issue. Is anyone e
Electronics Forum | Tue Sep 05 14:31:42 EDT 2017 | rgduval
Create a package, set the mechanical centering to the dimensions of the 8-DFN that you're trying to place, test the centering. Tweak the dimension that's failing. Shouldn't be too much of a problem. An 8-DFN package is nothing more than a rectangu
Electronics Forum | Mon Mar 11 06:49:42 EDT 2019 | SMTA-Bob
You problem will be related to the part type or the design. Standard 40 or 100 pin QFN or LGA parts are not going to drop due to weight as they are just a few grams. If you send a photo of the PCB pad footprint and the component separately I may be a
Electronics Forum | Tue Dec 26 17:59:52 EST 2000 | Dan Dickey
I am in need in identifing these 2 components. I am new in the SMD world so bear with me. These are in a SOT-23 package. Need to idendify. 1\ C5D 2\ R2T 3\ R2X Thanks, Regards, Dan
Electronics Forum | Thu Feb 28 13:49:34 EST 2002 | Jeff D
Actually when you use CircuitCAM you do not have to digitize every component. Once one package is digitized CircuitCAM will scan for other pacakges like that on the board. In regards to Unicam, they do not have one, but instead use a third party Ge
Electronics Forum | Thu Nov 30 17:00:59 EST 2000 | Charles Morehouse
I am interested to know what people prefer for fine pitch packaging. Tape/Reel or Waffle tray for .031", .025", .020", .015" pitch components? What is the most robust packaging (i.e. fewer bent leads, etc.) Chuck
Electronics Forum | Mon Jul 10 09:28:20 EDT 2000 | George English
I am looking to purchase an inexpensive gerber editing package. Does anyone have any ideas. It will be primarily used for the design of solder paste and adhesive stencils.
Electronics Forum | Tue Jun 06 18:58:03 EDT 2000 | Dreamsniper
Hi guys, I'm looking for a package drop test standard to compare our current standard whether it's still applicable. Thank you very much
Electronics Forum | Fri Jun 02 19:43:40 EDT 2000 | Ravi Bhat
One of my customers has asked about concerns, comments, ideas about putting 0402 packages on bottom side of the board. The process will be no clean with reflow/reflow. If anybody out there has some experience or concerns please comment. Regards
Electronics Forum | Fri Jun 02 19:42:40 EDT 2000 | Ravi Bhat
One of my customers has asked about concerns, comments, ideas about putting 0402 packages on bottom side of the board. The process will be no clean with reflow/reflow. If anybody out there has some experience or concerns please comment. Regards
