Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake
The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil
Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell
Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems
Electronics Forum | Fri Aug 29 04:33:52 EDT 2014 | mun4o
Hi all, we have 2 smd line with 2 topaz x|| each.The machines are 10 year old.Now we need more capacity and I am looking for new line.Because there is not space for third line , we must change the p&p with more productive machines.I like Yamaha , an
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Mon Apr 26 17:31:14 EDT 1999 | Earl Moon
| Hey MoonMan, | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop! "Foiled"
Electronics Forum | Mon Jun 02 11:01:19 EDT 2003 | emeto
Hi All, I am looking for some standart for pad and component dimencions. Is there anything more accurate than 30% and if so who works with it? Which libraries are based on some standart? Is there a catalog I can read or something in electronic format
Electronics Forum | Tue Jun 03 08:15:10 EDT 2003 | davef
On pad design, look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=18036 On component sizes, look here: http://www.practicalcomponents.com
Electronics Forum | Tue Sep 23 23:19:34 EDT 2003 | RLW
If you have a board that you've run several times, now you run it and like before all settings are the same, but now you have 0603's randomly skewed or an inch or so away from their intended pad (as if popped up in the air), or an occasional 7343 cap
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
