Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
Electronics Forum | Thu Mar 08 18:39:06 EST 2007 | elias67
Stencil Thickness should be .005" A reduction along with cross hatching is a must for the center pad to reduce paste volume as well as to assure even paste deposit while printing on a large pad. With out the cross hatch, the squeegie will most like
Electronics Forum | Sun Jun 10 11:31:27 EDT 2001 | nifhail
Everybody aware of the tomb-stone problem on 0402 package. I've done everything I could i.e. Profile, placement, 10 Deg placement, stencil design, but still this culprit exist. One things for sure is taht I have a very bad pad size for 0402 ( 25 mil
Electronics Forum | Fri Mar 02 16:26:57 EST 2007 | Steve
1- Thickness 0.005" 2- I usually reduce 50% of the thermal pad, but it also depend on original size of thermal pad somehow I have to either create window panel or crosshatch otherwise component wil get wimming during reflow. Hope this will help. Reg
Electronics Forum | Wed Jun 17 05:41:04 EDT 2020 | SMTA-Davandran
I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it.
Electronics Forum | Mon Dec 18 21:17:41 EST 2006 | davef
Use the IPC calculator [free at http://www.ipc.org]
Electronics Forum | Thu Dec 14 22:28:38 EST 2006 | Tony
Hi, where can I find info about how to make the pad design to work for VSSOP48 0.4 mm Pitch & TSSOP56 0.5 mm pitch components? I should also mention that we are working in a project that this 14 layers High-Frequency RoHS board is included. The pad c
Electronics Forum | Wed Nov 14 13:05:40 EST 2007 | rgduval
I had one project with micro-vias in 0805 and larger pads, with no issues. But my most recent project had vias that were larger than the 0402 pads that the via was in. To the point that for a number of the lands, there was no visible pads (a couple
Electronics Forum | Thu Nov 15 08:25:08 EST 2007 | rgduval
I do think that the designer goofed, and used too large vias. I believe he only used on size via on the entire board, regardless of whether it was in a pad, or out on the board. I have seen vias in pad work, though. From a manufacturing standpoint
Electronics Forum | Mon Oct 27 09:54:40 EST 2003 | John
We're just now beginning to see 0402's in our designs. Can anyone make recommendations on stencil/aperture designs and print parameters? I'm seeing skips on a small number of joints on these parts. Thanks in advance, John