Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Electronics Forum | Tue Jun 09 13:16:18 EDT 2009 | jack100
We are looking at feasibility concerns of using a QFN 16 from Motorola. I have a couple of questions regarding their recommended PCB design guidelines. 1) Does anyone know why they would recommend coming out of the pads with a narrow trace (.1mm wid
Electronics Forum | Tue Oct 02 13:55:12 EDT 2012 | ericrr
OK I can take a hint when asked for a photo. I did not try to take a photo as I thought the close up image would put the picture out of focus, so this is where a bit of graphics works might help explain the problem. When I had a look at the 1206 p
Electronics Forum | Thu Apr 12 22:54:06 EDT 2007 | mika
conductor on the narrowest place ~0.07mm we suggest them to go for a PCB solder pad down to 0.30mm. The Conductor width is: 0.2mm The current problem they are having now is that there will be a problem with 14V to narrow the conductor to the narrowe
Electronics Forum | Thu Mar 23 10:02:09 EST 2006 | Joe
Check placement pressure. I agree with the "smushing" theory. If you can place the component with less pressure, I'd do that first. A switch to Type three paste is also a good idea, as long as your minimum aperture dimension remains at 0.009" as you
Electronics Forum | Tue Apr 15 15:12:50 EDT 2014 | bradlevy
Thanks Bob. I just didn't have enough experience with production SMT (vs hand-soldered prototypes) to know how finicky some things like this are. I've tried to do a lot of reading, but I haven't seen much that talks about things like this. I also hav
Electronics Forum | Tue Nov 09 14:21:00 EST 2004 | Dreamsniper
Thanks Russ. When solder paste is applied, you can't see the pads. Because my aperture reduction is 5% - 10% of the pads. Pads are reduced by almost and up to 20% by the PWB Fab and the paste covers the pad. We cal align and inspect but very hard as
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
Electronics Forum | Tue Jun 08 08:40:37 EDT 1999 | Wister
Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl
Electronics Forum | Tue Jun 08 08:38:15 EDT 1999 | Wister
Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl
