Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Electronics Forum | Sat Aug 05 00:25:26 EDT 2017 | jlawson
Koh Young can also import ODB++ files, ALL major EDA tools offer ODB++ export, Mentor EDA tools for sure, Cadence, Altium, Zuken all offer ODB++ export...This has Part entities included as well as graphic data etc - is a full product data model. Can
Electronics Forum | Sat Jan 03 17:43:31 EST 2009 | proy
Hi Wondering if anyone here is/are filemaker Pro users? I am writing a simple data collection program in Filemaker for pre-solder, pre-test inspection to replace paper sheets. Together with wireless touchscreen tablets I think this is going to be
Electronics Forum | Fri Dec 11 19:52:39 EST 2015 | dontfeedphils
I've dealt with MyData, Assembleon, Fuji, and Juki over the last 9 years with the majority being MyData and Juki so I'll talk about them. MyData was very nice for high mix/low volume due to the ease of setup and smart feeders, but I felt like I was
Electronics Forum | Thu May 01 13:58:31 EDT 2008 | mmjm_1099
In our house we have had some of our BGA's reballed because it was a lead-free part and wanted to place on a leaded assembly. Hope this helps.
Electronics Forum | Tue Jan 31 12:02:22 EST 2006 | aj
how would you apply both pastes.? anyway, I have succesfully run leadfree bga with lead paste. You gotta find a profile that kinda meets both requirements. Taking into consideration the peak temp and time above. dont have details on hand but I ca
Electronics Forum | Wed Aug 15 04:08:04 EDT 2018 | colinbenton
Hi Stephen, it seems they call it differently . What they need is an insruction data they can import to the machine, how the IC is soldered, the relative orientation for some parts,ect.
Electronics Forum | Thu May 01 12:46:19 EDT 2008 | dphilbrick
Thanks for the link Samir. Although this thread does have some good info in it I don't think it is hitting the exact point I am trying to resolve. This seems to talk to a one profile fits all for running lead and lead free paste. I want to know about
Electronics Forum | Tue Jun 01 19:25:19 EDT 2004 | Ken
...oops part 2: I will assume a sac 350 ball??? 217-218C this will completely reflow the ball and form a "normalized" joint with a collapsed structure.
