Electronics Forum | Fri Oct 09 04:06:27 EDT 1998 | Thomas Blesinger
| Thomas: What shape and size are the aperatures to print paste for the connector? Can you do something like ... | | 1 Using a (250m + 120m)/2 or so thick foil? | 2 Pinching the non-connector pads? | 3 Increasing the aperatures for the connecto
Electronics Forum | Wed Nov 01 13:28:41 EST 2000 | Fraser
Thomas, Dave is right - we had a similar coplanarity problem on some BGAs which we solved simply by over printing - no step required by nearly 2 x what happens is that the paste hight will grow as the paste reflows confined by the pad drop me line a
Electronics Forum | Wed Oct 07 14:28:25 EDT 1998 | MMurphy
| I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remainin
Electronics Forum | Thu Oct 08 22:20:44 EDT 1998 | Dave F
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Fri Oct 09 04:08:45 EDT 1998 | Thomas Blesinger
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
Electronics Forum | Wed Apr 10 22:46:04 EDT 2002 | davef
On SMTnet, we've discussed the the frailties of controlling paste height, when volume is a more telling measure. Sometimes if you seperate too quickly, the paste tries to stay attached to the aperture walls. This creates a 'U' shaped deposit with r
Electronics Forum | Thu Apr 11 10:14:05 EDT 2002 | BTaylor
We use the ASC vision master 212, our customers wanted a height and volume measurement rather than an inspector doing a visual. We have added this machine to our process, checking height on many preprogrammed locations then this generates a X bar and
Electronics Forum | Thu Oct 08 03:33:50 EDT 1998 | Thomas Blesinger
| | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remain
Electronics Forum | Thu Oct 08 22:32:58 EDT 1998 | Dave F
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
Electronics Forum | Thu Oct 08 03:27:00 EDT 1998 | Thomas Blesinger
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
