Electronics Forum | Thu Mar 31 07:56:31 EST 2005 | cn
I agree with chuck, but would like to add. 2D is a great option and helps to keep your printing process in check, it will measure the x & y coverage on the pad. It will help you determin when your stencil aps become clogged or when the bottom of your
Electronics Forum | Fri Dec 20 11:32:51 EST 2002 | D. Adams
Check your stencil apertures making sure they are trapazoidal and smooth. I have hadjobs where the laser stencil was improperly cut (poor laser settings leaving a rough hole even after electropolish. Be sure to specify a .0005 trapazoid in your ste
Electronics Forum | Thu Oct 18 08:08:19 EDT 2007 | chrisatae
We're looking for a high mix low volume paste printer. What are the Pro's and con's of the Opti Print 2020? I looked at the spec sheet and it looks like it will do what we need but usually there are issues during setup and operation. Any info would
Electronics Forum | Thu Mar 20 20:57:44 EDT 2008 | rrpowers
Well, we are in fact doing a no-clean, multi-shift, very high volume, minimal changeover operation. We use up any paste long before it gets old. Because of the sheer volume any reduction in paste scrap for us is big money. We also are in a zero de
Electronics Forum | Tue Mar 18 14:00:25 EDT 2008 | rrpowers
There are 2 reasons for wanting to change to an enclosed print system: - Reduce solder paste usage. (We run a high volume application so any reduction in paste scrap is a big money saver to our company.) - Improved print quality. (Ours is a non-rew
Electronics Forum | Tue Oct 06 17:36:20 EDT 2020 | hearsehauler
Have used stencils for low volume paste printing for 18 yrs. New job uses jet printing (MY500). But machine is limited to .33mm dot size. Parts used here have pad sizes that are .25mm or smaller, so paste touches between pads when printed. Thankfully
Electronics Forum | Mon Mar 27 20:34:22 EST 2006 | ms
Thanks for the suggestion. The large ground pad appears as a single large pad on the component and PCB but we print a matrix of 28 small dots of paste to provide the solder for the joint. The inconsistent volume transfer can occur on any of the fo
Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett
You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa
Electronics Forum | Wed Oct 25 10:11:09 EDT 2000 | Wolfgang Busko
Paddesign, aperture size and stencil thickness determine the amount of solder for your joint. Once you have found suitable parameters you need to control the volume of your paste deposit which is influenced by printer settings, paste condition, stenc
Electronics Forum | Wed Mar 07 08:37:29 EST 2007 | davef
First, don't put solder paste in a wave solder pot, the 50% by volume of organics and volatiles will gas off in an astonishing amount of fume, leaving a dismaying mess of spent resin and molten plastic in your pot. Second, when you say, "Paste that
