Electronics Forum | Wed Oct 20 16:05:47 EDT 1999 | Mark Charlton
I knew this would happen. Someone wants to rework a bad BGA artwork by cutting a trace and adding a wire under a 292p 1.27mm pitch PBGA. Has anyone done this before? What kind AND size wire do you use? How do you hold it in place during the replc
Electronics Forum | Wed Sep 29 04:33:35 EDT 1999 | Earl Moon
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Thu Sep 23 13:47:14 EDT 1999 | Terry Burnette
| | I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA. | | | | I Hope than you send my information about this. | | | | | Try this Link http://mot-sp
Electronics Forum | Sun Aug 02 20:31:22 EDT 1998 | karlin
Hi Bob, The weight of the TBGA is heavier then PBGA due to the Stainless steel heat sink. I have tried run them through the oven without paste. Due to the high lead content( 90Pb/Sn10), the "solder: did not melt. Still see the misalignment issue but
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Tue May 28 09:27:04 EDT 2002 | pjc
Does this PBGA have eutectic balls? If so and the PCB is HASL finish, or has solder on the lands from BGA removal, you may not have to apply solderpaste. Check with you flux supplier to see if they offer a NC "flux paste" product, otherwise I know Mu
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Thu Jun 21 14:36:06 EDT 2001 | dason_c
DaveP, I never see the Level 6 component, can you describe what is the package look like, ie high pin count PBGA, component thickness? DaveF, if we can store the components in the dry environment say below 10%, can we stop the floor life clock after
