Electronics Forum | Thu Mar 19 02:35:48 EDT 2020 | franknguyen
Hi, I got a new project, and need to provide customer the ICT (In-Circuit-Testing), FPT (Flying-Probe-Testing) process quotation. The new PCBA contains analog components, digital components, and some BGAs that can support Boundary Scan. Does anyone
Electronics Forum | Mon Aug 31 12:27:08 EDT 2020 | dontfeedphils
I guess my question would be why are you getting so much/leaving so much flux on the boards during the select solder process? With a drop-jet fluxer you should be able to apply the flux very selectively and leave a fairly clean looking PCBA, assumin
Electronics Forum | Wed Apr 20 01:57:47 EDT 2022 | sn
@ProcEng1 Yea. Mostly is ENIG surface finished PCB. Sometimes there is OSP board faces issues like part shortages and is forced to hold the production and resume the second process after a few days. So, would like to know any special control on keepi
Electronics Forum | Mon Jul 31 18:17:03 EDT 2023 | emeto
This is more lawyer stuff than engineering. In occasion like this one, it is probably time to open conversation around testing and hidden joints checks. In 21st century to perform only visual inspection is not a serious process, unless it is a very s
Electronics Forum | Mon Dec 29 23:35:42 EST 2014 | abhilash4788
Dear All, I'm just a budding engineer in EMS field. Here we used to manufacture different classes of PCBA. I would like to know about different process that need to be considered while manufacturing class 3 product. If we are going for microscopic
Electronics Forum | Thu Apr 14 17:24:06 EDT 2022 | cbart
depends on board finish and PCB substrate materials. If you were using OSP or silver finished bare boards the time to process is less than an ENIG or HASL finished. certain substrate material absorb more moisture than others or at a quicker rate. so
Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Sun Jun 07 19:09:21 EDT 1998 | Graham Naisbitt
Chiakl Ion Chromatography has been perfectly described by Dave, but here are a couple of extra considerations: Ion Chromatography will tell you precisely what is present on the surface of your board/assembly but it will not tell you whether it will b
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Fri Aug 27 00:26:14 EDT 2004 | charly
hi, encounter few cases PCB was delam after reflow, and the supplier was refuse that this is a PCB manufacturing defect as the fallout is low within one lot. the cost for this scrap is high after PCBA level, my query here are 1) is there any way
