Electronics Forum | Fri May 17 22:25:51 EDT 2002 | xzinxzin
*the other components are 0402 and SOIC 16, the solderability were good. *the protection on the terminations of microleadframe package is Cu(copper),somebody call that leadless leadframe package(LLP). *the time above 210 deg C is about 10 sec. *I us
Electronics Forum | Sun May 19 06:43:37 EDT 2002 | xzinxzin
I using water-soluble solder paste, the solder paste recommended, the peak temperature is 215 deg C, the dwell time above 183 deg C is 60-90 sec. **How I can do, the flux in solder paste is active enough to remove the corrosion on the Cu leads to get
Electronics Forum | Fri Jun 06 04:52:21 EDT 2003 | kevyeoh
Hi all, I am just wondering is there any other Lead Free Standard Profile for IR reflow besides the standard provided by Jedec ? What if the profile that i use is different from the one provided by jedec ? Lets say the peak temperature for Jedec is
Electronics Forum | Tue Mar 30 08:11:42 EST 2004 | steveliu
Hi, Has anyone here get some experience with SMT connector soldering? We were having really hard time to solder this AMP 50/50 Grid connector. Every connector installed has a few pins just sit on the solder. We use AIM 293DX2B NC solder paste, 60
Electronics Forum | Tue Jul 27 11:32:20 EDT 2004 | dwanzek
Thanks for the input guys. One problem with this theory, we see the same failure using Omni 5000 solder paste. We also see this problem across 4 production lines, suggesting it is not oven related. The profile meets recomendations and we have tried
Electronics Forum | Thu Dec 15 16:31:45 EST 2005 | Samir Nagaheenanajar
The general consensus is - you can run Pb-Free/RoHS parts in a Sn-Pb process as long as you RUN HOTTER. I've heard that "running hotter" means greater peak temperatures exceeding 217 / 221 C - common SAC alloy eutectic points. Anybody know any gene
Electronics Forum | Fri Dec 02 08:52:05 EST 2005 | pavel_murtishev
Good evening, I�ve just solved very similar soldering issue. In my case the problem was with 0603 chips. Solder joint had same appearance. I suspected that solder do not melted and increased TAL and peak temperature. No result. Next thing I tried to
Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir
Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma
Electronics Forum | Tue Sep 12 22:03:22 EDT 2006 | davef
Really Rocky? What's the meaning of Russ' "if it will fit" in your scheme? As an alternative to your scheme, he could glue the nut on its side, tie a string through the hole in the nut, attach the other end of the string to the open door, and the
Electronics Forum | Thu Oct 05 11:59:51 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon all! Theoretically, there should not be any issues soldering to the SN100C as the tin content of the molten paste alloy should wet to the finish with no problem. I would just ensure that the peak temperature of the joint is above the
