Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Fri Feb 19 09:29:38 EST 1999 | Justin Medernach
| What to look for that causes tombstoning and the corective action. | The three biggest causes that I can think of are placement machine component picking inaccuracy, placing inaccuracy, and design design design. If your placement platform is pic
Electronics Forum | Mon Feb 04 20:27:25 EST 2002 | davef
1,000 G ohm ||100 M ohm Dielectric Constant ||9.5 ||4.9 Loss Factor ||5 - 20 ||200 * E indicates exponent Continuing: * Spacing between same plane traces effect the electical parameters between the traces. * Dielectric materials used between diff
Electronics Forum | Fri Jun 06 18:44:26 EDT 2003 | davef
No, no. It's koscher to have thermal planes. You just need to: * Work with your fabricator to keep the layup balanced. * Relieve the plane so that it doesn't cause assembly problems. While probably not directly for your part, it gives a starting p
Electronics Forum | Mon Aug 11 17:48:39 EDT 2003 | Brian W.
Assuming you are working to IPC standards, are you working to Class2 or Class 3? Class 2 has an exception to the 75% barrel fill (para 6.3.1, page 6-7). "As an exception to fill requirements of Table 6-2 on PTHs with thermal planes or conductor
Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny
Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera
Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef
Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati
Electronics Forum | Tue Dec 28 21:51:04 EST 2004 | KEN
When using a foam fluxer: 1. Bubble size is important. What stones are you using? Ever clean them? Too large a bubble will NOT help your situation. (I forget bubble size range....check with your fluxer mfgr.) 2. Thinner will help in capilary m
Electronics Forum | Wed Feb 02 08:51:25 EST 2005 | Dougs
we have a capacitor cracking on one of our boards, there are four of the same cap on the board and only one cracks, we are seeing about 6% of the component cracking. it's not near the edges of the board and he board is 2.4mm thick so i dont think it
Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon
Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal
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