Electronics Forum | Fri Mar 14 16:13:06 EDT 2008 | keithej2
Has anyone ever heard of 0201 components being placed by Fuji CP43 machines? Engineering wants to do an experiment here to see if it's practical.
Electronics Forum | Wed Mar 11 10:55:07 EDT 2009 | gpost
I had contacted the dummy component suppliers but they didn't have anything that would work. We designed a simple daisy-chain PCB and die for SPC and training purposes, and purchased large quantities.
Electronics Forum | Tue Feb 18 11:06:49 EST 2014 | cunningham
Does anyone do this? We have a small booth and lots of different kinds of media to try. it will be local stripping of coating on components for rework purposes. My main concern is ESD levels and how best to measure this. Any ideas or any papers o
Electronics Forum | Fri Jan 12 14:05:33 EST 2024 | rygenetic
Hi @calebcSMT, It is generally recommended to avoid coating the entire body of aluminum electrolytic capacitors. These capacitors rely on the venting of gas in case of failure or overvoltage conditions, and coating the entire component could hinder
Electronics Forum | Thu Jan 03 08:02:48 EST 2008 | dstevenson
hi all and a happy new year, does anyone know if there are any industry best practices for board design in terms of selective soldering?? Whilst right now the product portfolio of my company is not suitable for the introduction of a selective solderi
Electronics Forum | Tue Oct 26 14:04:59 EDT 2004 | Mike Arman
I've been an electronics hobbyist for many years (almost 50!, that's scary), and I'd like to expand my "skills set" to include being able to work with SMT components. I know I'll need some sort of magnifying viewer, 35x has been suggested. I'll also
Electronics Forum | Mon Nov 01 22:16:04 EST 1999 | Dean
Without a detailed description of the suspect parts It is difficult to pin-point the exact solution to your process problem. However, whenever possible avoid non-value added additions to your current process. Here is the reality of the situation:
Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one
Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re
Electronics Forum | Wed Feb 25 11:37:01 EST 2015 | jasonnova
We have a customer with an assembly that will require potting using 3M DP-270. There is a component that needs to be covered with potting material but it is considerably higher than the overall potting height of the cavity. The low viscosity of the
Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette
Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w
