Electronics Forum: printing and consumables (Page 10 of 32)

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef

Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.

Re: Geometric Dimensioning and Tolerancing

Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon

| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor

Re: BGA and Gold Boards

Electronics Forum | Thu Jun 25 09:53:04 EDT 1998 | Earl Moon

| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | Mike, | You

kapton dots and liquid solder mask

Electronics Forum | Tue Aug 09 11:56:01 EDT 2005 | Rob

We sometimes use a peelable mask the the PCB manufacturer (board house) adds as part of their process. It may seem an expensive option but avoids: Raising P/o's for tape/peelable mask as consumables booking & inspection Booking out to the shop floo

What were your top go-to sources for electronics information and learning in 2018

Electronics Forum | Tue Nov 06 10:28:58 EST 2018 | davef

Media Links IPC Global Insight This weekly electronic newsletter includes IPC news and multimedia information on manufacturing and management best practices and solutions, new technologies, standards, government relations and environment, health and

Re: Desoldering of TSOP and TSOJ

Electronics Forum | Fri Jan 08 15:02:38 EST 1999 | Dave F

| HI! I am a package engineer in Korea. I have some reasons | to desolder excessive solder at the lead of TSOP and TSOJ | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | Does anyone

kapton dots and liquid solder mask

Electronics Forum | Tue Aug 09 13:25:24 EDT 2005 | pr

From what I can gather, the annular rings are used for grounding when these boards are put in housings. A screw goes through the hole and is torqued down. If there is excess solder on the annular ring, the screw doesn't seat properly. The pallets cov

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 12:08:09 EDT 2005 | slthomas

The answer for us at my previous employer was water soluble flux. Wash the board, no residue. If you're not set up to wash (needing a washer, DI water source, waste treatment, ventilation, etc.) it can be expensive and space consuming. Do some resea

BGA: reworking BGAs, testing and inspection

Electronics Forum | Mon Feb 08 14:08:08 EST 2010 | sparky_

Greetings, We are looking to purchase equipment to rework / repair our circuit boards with BGAs. Our newer boards are starting to have more and more BGAs. Is there any information that "ranks" BGA rework stations? - a kind of a consumer reports for

Aperture Adjustments and Etch Compensation on Arrays

Electronics Forum | Mon Sep 23 10:45:34 EDT 2019 | slthomas

I have seen similar things happen with over etching and bridging but frankly the most common mistake that gives us grief is a failure to use the component manufacturer's recommended land pattern and/or aperture designs. As opposed to generating a n


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