Electronics Forum | Mon Mar 03 13:18:02 EST 2003 | msivigny
Hello phil, The use of AOI systems give us the opportunity to auto-collect defect information much the way you're using them now. AOI systems become extremely effective when the collected data is used to perform some positive change into the process.
Electronics Forum | Sun Nov 08 10:22:52 EST 2009 | doremi
Hi everybody, First of all, to have process under 100% control you should have AOI after every active process in the pcb assembly line : - Post printing (2D or 3D Solder paste inspection machine); - Post reflow; - Post selective(wave solder). It i
Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua
Electronics Forum | Sat Jan 29 23:55:58 EST 2005 | KEN
I recently ran a process evaluation (Print/ P&P /Reflow) and was plesently surprised with a 5.0 sigma process or 250ppm. Attrition was under 1%. Keep in mind this is defects counted Post-reflow. The most signifficant defect was tombstoning / draw-
Electronics Forum | Fri Nov 23 03:40:09 EST 2001 | ianchan
Hi All, agree 100% on product characteristics SPC, and do find process indicators such as paste Volume, useful to monitor via SPC, the printing process, as printing constitutes "70% cases of SMT defects". We juz purchased a 2nd hand CyberOptics 3D
Electronics Forum | Tue May 15 17:24:52 EDT 2012 | jeremymek
Hi Before I say anything I ll qualify who I am. I work for a AOI/SPI manuafacturer Automatic printer is your best option for small runs. Print process is responsible for a vast number of solder defects and improving here is your best start. Have a
Electronics Forum | Tue Feb 20 21:19:43 EST 2001 | davef
You�re correct, many of us recognize that problems in paste deposition are the source of the majority of SMT component defects. What would you say that the portion of the "51 to 72% of all solder defects are the result of screen-printing problems" t
Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef
You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo
Electronics Forum | Thu Apr 04 16:38:51 EST 2002 | davef
Equipment companies like to talk about �accuracy� and �repeatability�. These measures provide limited information. Flaws of the measure aside, some printer companies have begun to report Cp. * DEK ELA: Cp = 1.33 @ �0.025mm * DEK 265: Cp = 1.6 @ �0.0
Electronics Forum | Wed Aug 21 12:57:41 EDT 2002 | dragonslayr
I would like to address several issues. First, your reflow is 150 PPM for the same exact assemblies that have lower PPM's? or are you giving a 150 PPM rating for all products produced through the reflow process in a specific time period? Reflow is a
