Electronics Forum | Fri Dec 17 08:45:26 EST 1999 | Wolfgang Busko
Hi Henry, amoung all things that cause this funny effect the most effective measures in my experience were good PCB design (pads and equal thermal conditions for both sides of the components), placement accuracy and profiling, profiling, profiling. L
Electronics Forum | Tue Sep 14 10:54:37 EDT 1999 | Scott Davies
| Can anyone out there pls enlighten me on how to solve chip tombstone defects. | I am running a board with a lot of 0603 chip. i had fine the profile and the alignment, but it still happen randomly on the board itself. Is there any other way to sol
Electronics Forum | Sun Jun 10 11:31:27 EDT 2001 | nifhail
Everybody aware of the tomb-stone problem on 0402 package. I've done everything I could i.e. Profile, placement, 10 Deg placement, stencil design, but still this culprit exist. One things for sure is taht I have a very bad pad size for 0402 ( 25 mil
Electronics Forum | Thu Apr 24 23:04:45 EDT 2003 | yukim
I've been struggling with this problem for a while. We have two products: A, which is Ok and B, with tombstone defect (0603 & 0805 capacitor chips). A & B have the same design: pad sizes, separation between pads, components orientation. Both have s
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Wed Aug 01 10:28:11 EDT 2001 | btaylor
We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej
Electronics Forum | Wed Aug 01 10:28:24 EDT 2001 | btaylor
We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej
Electronics Forum | Wed Nov 06 11:35:19 EST 2002 | slthomas
Is it possible that your HVAC system activity is having an effect on your product, as in drying out (or adding moisture to) your paste, or something like that? Have you compared your profiles during wide swings on outside temperature? I'm still on
Electronics Forum | Fri Aug 18 03:46:29 EDT 2017 | stivais
The first reply from Tsvetan Usunov already answered your question - there are no thermals for one side of the chips. You can try to reduce the phenomenon by using different solder pastes, tuning your soldering profile or even switching to different
Electronics Forum | Tue Sep 08 23:12:57 EDT 2020 | SMTA-64387687
Have you tried rotating the board 90 or 180 going into the oven? With inductive components there's a possibility of magnetic current buildup, that pulls the component to one of the pads. Although, I've only seen it on larger inductors. Also, the pres
.gif)
