Electronics Forum | Wed Jul 15 08:36:41 EDT 2020 | dproldan
Using a X-Rays machine, we have noticed that one component we are using has the silicon die bonded at an angle in the package. Have you ever seen something like this? I'm not sure if it's intentional or a manufacturing error.
Electronics Forum | Tue Apr 27 23:10:16 EDT 2010 | mbrunton
I am looking at buying a pick and place machine to assemble the circuit boards we make. Most of the boards are small (2 to 10 square inches), most are 2 sided, and have maybe 20-50 parts per side. I use mostly 0805/0603 chips, SOT-23, SOD-123, SOIC
Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
Electronics Forum | Wed Mar 15 04:36:16 EDT 2017 | Rob
@ Sr.Tech, Any voiding means that the part of the package under the void is not forming a solid thermal interface with the PCB, therefore it's heatsinking capability is reduced. With the drive for smaller packages with higher power handling capabil
Electronics Forum | Tue Jun 09 13:16:18 EDT 2009 | jack100
We are looking at feasibility concerns of using a QFN 16 from Motorola. I have a couple of questions regarding their recommended PCB design guidelines. 1) Does anyone know why they would recommend coming out of the pads with a narrow trace (.1mm wid
Electronics Forum | Wed Feb 13 10:39:36 EST 2019 | spitkis2
The QFN will add an insignificant amount of thermal mass since its all in the housing. You just need to make sure the package does not exceed the recommended peak and duration so as not to damage the die internally. Usually the limit is around 250-
Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw
All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req
Electronics Forum | Fri Jun 28 06:12:27 EDT 2013 | grahamcooper22
If the soldering process isn't heating the whole package up to soldering temp then NO you don't need to keep them DRY (using a soldering iron to fit a QFP for example)....but if the soldering process is done on a rework station or in a manner where t
Electronics Forum | Fri Jun 20 09:38:56 EDT 2003 | caldon
Hi John- First, I do not have first hand experience so my input is pure theory. This type of package (in Some Cases) has a center grounding bonds and leadless legs ups the difficulty tremendously. With no stand-off from the Balls(or Legs) when the so