Electronics Forum: quality and metrics (Page 10 of 21)

Lead Free and Leaded Process Mix

Electronics Forum | Tue Jul 19 06:33:56 EDT 2005 | Rob

Hi GS, Thanks for responding - looks like we already put end termination coating on the label - we just call it "second level interconnect" There is a specimen label at: http://www.anglia.com/quality/labels.pdf Regarding standardising labels accr

OSP and getting full pad wetting??

Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak

what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal

Compressor for Pick and Place line

Electronics Forum | Thu May 28 16:18:01 EDT 2020 | SMTA-Brandon

The reason for recommendations about refrigerated vs. desiccant dryers commonly comes down to the ISO class of compressed air they deliver. Refrigerated dryers are most commonly used in ISO Class 4 compressed air, and can't dry the air enough to reac

Stencil Printing Process Troubleshooting and control

Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas

Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi

Touch-up and inspection of visual defects

Electronics Forum | Wed Apr 27 11:43:32 EDT 2005 | patrickbruneel

Hi Daan, What we did in the time was pareto analyses on all board designs to determine the critical areas (mainly design errors) and only inspect those specific problem areas. Every batch had a copy of the PC board with problem areas marked and only

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 15:05:23 EDT 2005 | Shean Dalton

Dear Ing, Have you analyzed why some RF device aren't operational after washing? An assumption is that failures are related to the ultrasonic energy applied. Other possibilities are for poor rinsing, poor drying, inadequate washing on those failed

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 11:33:54 EDT 2007 | realchunks

Just starting and already responsible for product quality and machine adjustment? Wow, you poor bastard. Ok, I will assume this problem happens on the bottom side of the board with a thru-hole IC. The short occurs on the side that doesn't have the

Micro Solder Balls and Vias bridging Issue

Electronics Forum | Tue Mar 03 09:29:48 EST 2015 | rgduval

A couple of things that have helped me with solder ball issues at wave in the past: 1. Flux. Insure good flux coverage on the bottom of the board. 2. Preheat. Insure that the board is sufficiently preheated for the wave operation. Since you're

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker

Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a

Process control, SMT inspection and rework

Electronics Forum | Mon Apr 15 21:55:46 EDT 2002 | ianchan

Hi Clark, Out of curiousity and in the name of learning new stuff, can you share with us how does your team, calculate the cost of inspection? Is inspection an additional chargable item in the quotation sheet? To quote your posting : "Just a side n


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