Electronics Forum: reflow and pizza (Page 10 of 50)

CSP and underfill

Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi

weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??

0402's and Gluing.............

Electronics Forum | Wed Feb 09 18:22:20 EST 2005 | mrduckmann2000

Valerie, Thank you for your reply. I have a quick question......when you converted to a double reflow process did you have any thru-hole parts on the assembly. If so how did you handle them....pin and paste? Thanks, mike

Immersion gold and BGAs

Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya

I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.

Wave and Reflow Profiler

Electronics Forum | Tue Feb 19 05:00:07 EST 2008 | muarty

We have used both Datapaq and ECD Mole in the past. Either system will do the job for you, slight preference would be for the ECD system.

Wave and Reflow Profiler

Electronics Forum | Tue Feb 19 07:44:41 EST 2008 | tonyamenson

So just to clarify.... If i bought a KIC 2000 I could run that one unit over both my waves and through both my ovens (leaded and lead-free)? Or would I need additional equipment to use it on the wave?

Wave and Reflow Profiler

Electronics Forum | Wed Feb 20 08:07:46 EST 2008 | ck_the_flip

Here's a good thread on this topic: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9859&#Message39714

High-end SPI and AOI?

Electronics Forum | Tue Jan 12 15:54:09 EST 2010 | chupitoone

Hi, Orbotech actually sold it's division to ORPRO Vision. They development of the equipment is still progressing in both their Reflow inspection and SPI systems. Both have newer versions of software released and at the show in SanDiego they demonstr

0201 and Lead Free

Electronics Forum | Tue Dec 13 09:29:08 EST 2011 | swag

We're soon to build a lead free assembly with 0201 components. I'm not worried about placement as our machines can handle it. Any tips on printing, screens, reflow?

NADCAP and thermocouple calibration

Electronics Forum | Wed Aug 07 12:35:36 EDT 2013 | cyber_wolf

I was asked how we verify that the thermocouples INSIDE the reflow oven are calibrated. That seems pretty impractical to me. Has anyone come across this ?

Headers and SMT

Electronics Forum | Fri Oct 30 10:17:05 EDT 2015 | esoderberg

You don't say how many headers you have to solder. I usually spec in High temp headers and use a pin-in-paste methodology and double reflow. Can you get your headers high temperature?


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