Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.
Electronics Forum | Tue Sep 02 13:30:11 EDT 2008 | hermes
Try this. Basic reflow profile build up and explanation of its parts: ramp-up, soak or no soak, peak, cooling. Good starting point.
Electronics Forum | Fri Apr 23 12:47:29 EDT 2004 | barry
I have increased my peak to 220, and Flow is better, but it still not quite a good fillet all around. The solder tends to kinda "bunchup" at the toe of the lead. If part is Pb free, would this affect adhesion and or flow?
Electronics Forum | Mon Jul 10 05:45:50 EDT 2006 | Rob
Hi Dougs, Check out the PBTs (Peak Body temperatures)and time at these temperatures. Remember that they sit higher in the ovens than most other parts. If you have problems getting that data I should have it for Tyco, JAE, Hirose, Harting & a coupl
Electronics Forum | Wed Jun 15 10:30:18 EDT 2011 | SBecmpe
If you have the ability to control top and bottom zone temperatures verify that the difference in your peak area is 10 to 20 degrees. This will depend on the ovens capabilities.
Electronics Forum | Wed Jan 15 10:31:55 EST 2020 | emeto
Having 10c thermal differential is a lot. Trying different paste might help - usually thermal expansion makes component detach from PCB, then joint is formed and solidified, then component goes back but is too late to form a joint. Cooling speed migh
Electronics Forum | Wed Aug 09 08:59:52 EDT 2006 | zanolli
I agree with verifing this part is even high temp reflow compatible. The age of the original dwg release, 1986, and as there is no mention of high temp reflow compatibility, only a mat'l call out of nylon, leads me to think it is not.
Electronics Forum | Thu Apr 15 17:06:08 EDT 2004 | russ
What are your temps at the locations that you are having trouble with. We cannot tell anything by the zone settings of an oven. We need max temp, how long above liquidous etc.. a lot of times this symptom is due to too long of a soak at too high o
Electronics Forum | Wed Sep 23 03:43:31 EDT 2009 | d0min0
hello, we are profiling with the pcb each day - results are very good with a small delta we made another test board with TC only in the problem places - same good result we tried 500-600 boards on 12 zone machine - zero defects while on standard 6
