Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon
| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor
Electronics Forum | Mon Jul 28 16:48:54 EDT 2008 | pcbbuilders
my oven has a built in profiler, it works fairly well, but it can not predict changes. my main concern was about the time right before reflow. i know that's where the flux is activated and i was worried that i may be spending too much time at the tem
Electronics Forum | Fri Aug 01 21:10:35 EDT 2008 | leo_dektec
You can keep only the 5th zone as the reflow zone. And lower the first two zones to keep a good ramping rate. Meanwhile,please note the ting temperature in software or control panel is not the exact temperature in your PCB, you'd better get a KIC or
Electronics Forum | Tue Aug 10 11:23:11 EDT 1999 | danielm
We currently have 32 LEDs per board and are looking to change the LED from a gull wing package to another package. (possibly a chip type package). I have heard that some cases and LEDs do not like reflow. This part is not cost effective to have to pu
Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe
OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by
Electronics Forum | Wed Sep 15 09:17:52 EDT 2010 | eniac
Hi all! Does any body know which company is real manufacturer of this reflow ovens? Manncorp is only distributor (and in USA), I can't buy it in USA and move to Eastern Europe :( I need to find who produce this ovens, can somebody help to me? Than
Electronics Forum | Mon Apr 16 10:01:03 EDT 2012 | patrickbruneel
*Like*
Electronics Forum | Wed Aug 12 03:43:01 EDT 1998 | Terry Keen
We are taking enquiries for sub-contract work that we hope to be doing by Christmas. One of the enquiries is to assemble chip capacitors and an SO14 onto ceramic. Does the printing process, paste used and reflow process remain the same, or are there
Electronics Forum | Mon Nov 21 16:34:03 EST 2011 | davef
Google: nitrogen reflow tombstone https://www.google.com/search?q=nitrogen+reflow+tombstone&ie=utf-8&oe=utf-8&aq=t&rls=org.mozilla:en-US:official&client=firefox-a
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
