Electronics Forum: rising (Page 10 of 25)

High Temp Reflow Lubricants

Electronics Forum | Wed Aug 03 10:14:59 EDT 2005 | Wonderboy

With oven temps rising due to Lead-Free Processing, I'm looking for some information on high temp Reflow Oven lubricants. I've found some info in the Fine SMTnet Archives on Chain Lubricants, (Mostly Synthetic Motor Oils), but I'm wondering what othe

Use of solder paste after taking out from cold storage

Electronics Forum | Thu Oct 27 00:45:41 EDT 2005 | pavel_murtishev

Good morning, I can recommend to use solder paste softeners, which can prepare solder paste for printing process. Softeners rise paste temperature by means of pseudo-planetary motion. Therefore, solder paste reaches room temperature during only 15

SAC305 Solder Balling

Electronics Forum | Thu Aug 17 10:30:08 EDT 2006 | Chunks

Hi McGill, The straight ramp is "straight" from the manufacturers of the material. Using old process techniques from your old process materials no longer applies. We all miss the good old days, but it�s time to move on. Being of Asian descent, I t

Cracking

Electronics Forum | Thu Sep 07 08:50:45 EDT 2006 | Grant

Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has cracked off the PCB. It's below the intermetalic layer in the ball. Reflow otherwise looks good, and the raw components are clean. I am wondering what c

Fuji IP-1 cycle alarm Z axis

Electronics Forum | Thu Feb 01 02:36:40 EST 2007 | bvdb

Hi pr, The problem was happening on all three of the nozzles that we were using, about half the time the Z axis would rise up and go for the next nozzle and the other half it would stop almost as soon as it released the nozzle. When I inch the Z ax

Lead-Free BGA Rework

Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir

*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and

Fuji CP6 XY Table

Electronics Forum | Wed Oct 29 20:58:31 EDT 2008 | rmitchell

Hi, Our Fuji CP6 table is rising up abruptly when it unloads a pcb after populating it. It makes a clunking noise much louder than before. I don't see anything that has changed or gets in the way as far as the table rails lining up with the exit c

Pb Drying / Degassing PWB

Electronics Forum | Mon Nov 24 07:36:15 EST 2008 | davef

No, but we find discussions about relative humidity fairly short sighted, because relative humidity is such an imperfect measure of the amount of moisure in the air. Dew point is much more appealing. R.H. = (amount of moisture)/(maximum amount that

AOI False calls

Electronics Forum | Thu Mar 26 21:03:24 EDT 2009 | bigdaddysoy9

I have noticed this on some of our large multi-circuit panels. It's such a slight rise in our false call rate that I haven't really explored it. I'm just guessing that it has something to do with the fiducials calculating the twist/shrink of the boar

What is the preffered spacing between PTH and SMT pads

Electronics Forum | Thu Apr 30 22:40:32 EDT 2009 | davef

Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies Written by Makram Boulos, Craig Hamilton, Mario Moreno, Ramon Mendez, German Soto and Jessica Herrera Circuits Assembly Magazine, 31 December 2008 19:00


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